Nvidia Senior Ballout Designer 

United States, California 

901100942

What you’ll be doing:

• Work closely with System Level Architects and product teams to develop high-performance semiconductor BGAs pinouts, optimizing signal integrity and manufacturability.

• Collaborate with design teams to define product requirements, specifications, and goals.

• Coordinate with package design teams to optimize interfaces between PCB, package, and silicon.

• Optimize BGA ballout and layout to achieve superior signal integrity, power integrity, impedance control, and minimal crosstalk.

• Power delivery and decoupling placementoptimization.

What we need to see:

• Bachelor's degree in Electrical Engineering or equivalent experience.

• Strong knowledge of signal integrity analysis and PCB layout design principles.

• Excellent communication skills and the ability to think around corners to find solutions.

• Minimum of 6+ years experience in high-speed design.

• Proficiency with Cadence Allegro or comparable PCB design tools.

• Breadth and Depth of knowledge in PCB technologies

  • HDI, Blind and buried vias, Backdrill, standard thru hole

  • PCB Material knowledge

• Ability to work well in a cross-functional environment on challenging projects.

Ways to stand out of the crowd:

• Experience in package design or coordination with package design teams and signal integrity.

• Familiarity with industry standards and guidelines for PCB layout design

• Track record of working on projects involving high-speed interfaces (e.g., DDR memory, PCI Express, Ethernet).

• Understanding of power integrity considerations and multi-gigabit design challenges.