Intel Advanced Packaging Flagship Curriculum Internship Program 

Malaysia, Kedah, Kulim 

896956851

Responsibilities and scopes may be quite diverse depending on the function or project assigned. The industrial exposure and technical skill learned will enhance the students knowledge and experience for their future career undertaking.This internship is only open for the undergraduate student who has taken the Advanced Packaging Flagship Curriculum and required to undergo the internship program by USM academic plan.We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing BenefitsThis role will require an on-site presence.