IBM Process Integration Yield Engineer 

United States, New York, City of Albany 

876256611

Responsibilities:

• Design and conduct experiments leveraging semiconductor process technology to optimize performance and yield.
• Track progress of hardware and analyze data to determine best conditions to optimize the process.
• Full ownership to identify issues and recommend solutions to improve performance and yield, such as defectivity reduction.
• Design macros and circuits to evaluate various layouts.
• Create and protect Intellectual Property (IP).
• Create development routes, actively maintain process controls, and track process changes.
• Condense and present analyses and reports with a focus on effective technical communication.
• Identify and drive opportunities for operational and quality improvements.

Required Technical and Professional Expertise

• Ability to independently troubleshoot and solve complex problems
• Ability to communicate and work with a dynamic interdisciplinary team composed of electrical engineers fabrication engineers and experimental physicists
• At least 2 years experience in microelectronics materials and process integration, chemistry or materials science research, and/or applied physics research
• Demonstrated understanding of device physics of Superconducting Qubits
• In-depth knowledge of Process Integration of semiconductor devices
• Demonstrated understanding of Yield and Electrical Characterization

Preferred Technical and Professional Expertise

• Good understanding of Design and Electrical test setup
• Good understanding of defect Yield pareto build
• At least 5 years experience in microelectronics materials, process integration and device characterization
• At least 3 years experience in Far Back End of Line (FBEOL) / 3D Integration / Chip Packaging
• Experience with fabrication processes for superconducting materials
• Understanding of Simulation/Emulation
• Strong presence and organization within team