Microsoft Principal Electrical Engineer - Signal Integrity/Power Integrity 

United States, California, Mountain View 

798761542

Required/Minimum Qualifications

• 12+ years of technical engineering experience
• OR Bachelor's degree in Electrical Engineering, Computer Engineering, or related field AND 10+ years of technical engineering experience
• OR Master's degree in Electrical Engineering, Computer Engineering, or related field AND 8+ years of technical engineering experience
• OR Doctorate degree in Electrical Engineering, Computer Engineering, or related field AND 3+ years of technical engineering experience.

• 5+ years of Electrical Engineering experience inSignal Integrity and Power Integrity design.
• 5+ years working knowledge of simulation tools such asAnsys EM,Spice, Cadence Sigrity/Aurora, MATLAB,Keysight ADS, etc.

Other Requirements

Candidates must be able to meet Microsoft, customer and/or government security screening requirements that are required for this role. These requirements include, but are not limited to the following specialized security screenings:

• : This position will be required to pass the Microsoft Cloud Background Check upon hire/transfer and every two years thereafter.
• Citizenship & Citizenship Verification: This role will require access to information that is controlled for export under export control regulations, potentially under the U.S. International Traffic in Arms Regulations or Export Administration Regulations, the EU Dual Use Regulation, and/or other export control regulations. As a condition of employment, the successful candidate will be required to provide proof of citizenship, U.S. permanent residency, or other protected status (e.g., under 8 U.S.C. § 1324b(a)(3)) for assessment of eligibility to access the export-controlled information. To meet this legal requirement, and as a condition of employment, the successful candidate’s citizenship will be verified with a valid passport. Lawful permanent residents, refugees, and asylees may verify status using other documents, where applicable."
• Citizenship & Citizenship Verification: This position requires verification of U.S. citizenship due to citizenship- based legal restrictions. Specifically, this position supports United states federal,state, and/or local(or applicable country) United States government agency customers and is subject to certain citizenship-based restrictions where required or permitted by applicable law. To meet this legal requirement, citizenship will be verified via a valid passport.

Additional or Preferred Qualifications

• Experience with network analyzers, Time-Domain Reflectometry (TDR) and high speed scopes.
• Deep understanding of High-Density Interconnect (HDI) PCB design, Rigid-Flex PCB design, and PCB design tools like Cadence Allegro.
• Thorough understanding of the relationship between physical layout and electrical performance.
• Demonstrated ability to work well with cross-function teams.

Certain roles may be eligible for benefits and other compensation. Find additional benefits and pay information here:

• Electrical System Design: Engineer and architect electrical systems with a focus on enhancing signal and power integrity.
• Signal Integrity Analysis: Lead and conduct comprehensive signal integrity assessments, including measurements and correlations, for a variety of high-speed channels such as LPDDR, PCIe, DisplayPort, Thunderbolt, USB, MIPI, and other SERDES standards.
• Power Integrity Analysis:Lead and conduct power integrity evaluations for essential power and ground domains, including die-package Printed Circuit Board (PCB) co-simulation, selection and positioning of decoupling capacitors, and optimization of power distribution network (PDN) impedance.
• High-Speed Channel Validation:Verify high-speed channel designs through S-parameter and eye diagram measurements.
• Signal and Power Solution Development:Develop innovative signal and power solutions that align with the design goals of performance efficiency and cost-effectiveness.
• PCB Layout Reviews:Execute thorough reviews of rigid Multilayer Board (MLB), Flex PCB (FPC), and Rigid Flex PCB (RFPC) layouts.
• Cross-Functional Collaboration:Engage closely with multidisciplinary teams to analyze failures in high-speed interfaces and devise solutions to improve design quality and dependability.
• 
  Electromagnetic Compatibility / Electromagnetic Interference (EMC/EMI) and RF desense mitigation.
• Embody our and