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Apple Inductive Power Transfer DSP Architect Wireless 
United States, California, Cupertino 
787884766

03.04.2025
• Develop and own analog/digital simulation models of communication modules• Predict bit error-rate and packet error-rate estimates using simulation models• Participate in the development of innovative, new digital communication architectures for inductive links• Author engineering requirements specification and drive cross-functional product execution• Validate hardware/firmware implementation across full range of user operating conditions• Troubleshoot and analyze failures throughout the product development cycle
  • Experience in developing applications in DSP or digital communication applications is required and hands-on hardware bring-up and debugging (e.g., digital filters, FFT, sampling theory, modulation schemes, DSP/MCU, fixed-point implementations, algorithms)
  • Scripting and software tools — MATLAB, Python, C
  • BS and a minimum of 10 years relevant industry experience
  • MS or PhD in electrical engineering
  • Experience using bench equipment in the lab (e.g., oscilloscopes, spectrum analyzers, power supplies)
  • Basic circuits and circuit simulations (e.g., RLC circuits, op-amps, ADC, diodes, FET’s, SPICE, Cadence)
  • Experience authoring technical documentation, architectural trade-off analysis, and executive presentations.
Note: Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program.