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Google Microelectronics Numerical Simulation Engineer 
Taiwan, Taipei, Taipei 
781447155

22.07.2024

Minimum qualifications:
  • Bachelor's degree in Mechanical or equivalent practical experience.
  • 5 years of experience in microelectronics packaging (e.g., multi-chip modules, silicon photonics).
  • Experience in thermomechanical reliability prediction, mechanical drop/shock simulation.
  • Experience with Finite Element Analysis and Computational Fluid Dynamics and programming languages: ANSYS (APDL, Workbench, Icepak).

Preferred qualifications:
  • Experience with test vehicles and experimental validation of simulation models.
  • Experience in performing risk assessments based on failure data and incomplete information.
  • Experience with Statistical Software tools, Flotherm, Abaqus, Matlab, Python.
  • Experience working in cross-functional engineering teams including internal and external organizations.