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Google Microelectronics Numerical Simulation Engineer Taiwan, Taipei, Taipei 189725261
17.07.2024
Minimum qualifications:
- Bachelor's degree in Mechanical or equivalent practical experience.
- 5 years of experience in microelectronics packaging (e.g., multi-chip modules, silicon photonics).
- Experience in thermomechanical reliability prediction, mechanical drop/shock simulation.
- Experience with Finite Element Analysis and Computational Fluid Dynamics and programming languages: ANSYS (APDL, Workbench, Icepak).
Preferred qualifications:
- Experience with test vehicles and experimental validation of simulation models.
- Experience in performing risk assessments based on failure data and incomplete information.
- Experience with Statistical Software tools, Flotherm, Abaqus, Matlab, Python.
- Experience working in cross-functional engineering teams including internal and external organizations.
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