Intel Packaging Customer Engineer 

United States, Texas 

77592806

will include but are not limited to:

• Collaborate with IFS Customer product design, internal product design, Silicon process development, Intel's Assembly Test Technology Development (ATTD), and Product Engineering teams to drive product architecture definition, product package design and execution.
• Serve as the engineering interface to IFS Customers for packaging services to promote Intel packaging technologies, to perform technical feasibility and risk assessments, to analyze product ask vs. the ATTD packaging roadmap and to close the deal with the customer.
• Drive Customer-facing technology reviews as the key engineering interface between the Customer and Intel Foundry, owning the Customer packaging engineering relationship from product concept through product mass production.
• Work with IFS Business Development, ATTD, ATM and Supply Chain to complete RFQ risk assessments and pricing assessments.
• Capture customer feedback and competitive trends that can better inform the ATTD packaging roadmap.
• Represent the customer in internal technology working groups for new technologies during pathfinding and development.

In this role you will need the following attributes:

• Strong problem solving, analytical, and communication skills.
• Have demonstrated the ability to plan and manage projects.
• Extensive knowledge of Intel packaging development and manufacturing capabilities.
• Experience in ATTD and Competitor packaging roadmaps.
• Experience with product architecture floor plans, IP development cycles, and their dependency on package design and architecture.
• Be able to work independently in a highly matrixed structure with extensive experience presenting to Senior Management (VP and Corporate VP Level).

Qualifications:

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Job posting details (such as work model, location, or time type) are subject to change.

Minimum Qualifications

• Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science or in a STEM related field of study.
• 9+ years of experience in packaging, with emphasis on Intel's packaging offerings.
• Experience with power delivery, high speed signaling, thermal mechanical analysis, process development, or die disaggregation architectures.
• Experience presenting to external customers/suppliers.

Preferred Qualifications:

• Post Graduate degree in Electrical Engineering, Computer Engineering, Computer Science or in a STEM related field of study.
• Mandarin Fluency is a plus

Experienced HireShift 1 (United States of America)US, Arizona, PhoenixUS, California, Folsom
Position of Trust

Weoffer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here:

Annual Salary Range for jobs which could be performed in the US: