המקום בו המומחים והחברות הטובות ביותר נפגשים
Google Chip Packaging Technologist Google Cloud United States, California, Sunnyvale 771376957
14.08.2024
Minimum qualifications:
Preferred qualifications:
- Bachelor's degree in Materials, Mechanical, Electrical Engineering, a related field, or equivalent practical experience.
- 5 years of experience on advanced chip package technologies for pin count, power, and speed applications.
- 5 years of experience in package and substrate development for production.
Preferred qualifications:
- Experience in developing new technologies and driving innovation.
- Experience in assembly houses or wafer foundries.
- Understanding of multidisciplinary interactions between packaging technology, chip package electrical design, thermal and mechanical performance, and manufacturability/reliability.
- Understanding of advanced foundry process nodes and their interactions with package reliability and different package technologies.
- Knowledge of 2.5D and 3D packaging technologies, and advanced substrate technologies for HPC applications.
- Familiarity with general package assembly process, packaging materials, and reliability requirements (component and board level).
משרות נוספות שיכולות לעניין אותך
