מציאת משרת הייטק בחברות הטובות ביותר מעולם לא הייתה קלה יותר
IBM Research Hardware Developer Advisory professional United States, New York, City of Albany 753156634
Today
Required Technical and Professional Expertise
1) More than 5 years experience with 3D flip chip assembly, reliability testing, and failure analysis,
2) Basic understanding of wafer level packaging/assembly processes, laminate, reliability test, and tools ,
3) Ability to drive joint development with tooling/material supplier,
4) Positive and self-motivated and excellent presentation skills,
5) Ability to work in a team environment and to debug errors and solve problems.
2) Basic understanding of wafer level packaging/assembly processes, laminate, reliability test, and tools ,
3) Ability to drive joint development with tooling/material supplier,
4) Positive and self-motivated and excellent presentation skills,
5) Ability to work in a team environment and to debug errors and solve problems.
Preferred Technical and Professional Expertise
1) Hands on experience in semiconductor 3D packaging technology,
2) More than 5 years experience of flip chip assembly process (TCB, reflow), laminate technology, packaging reliability test, failure analysis, and semiconductor process,
3) Experience w/ design of experiments, process controls, and statistical data analysis,
2) More than 5 years experience of flip chip assembly process (TCB, reflow), laminate technology, packaging reliability test, failure analysis, and semiconductor process,
3) Experience w/ design of experiments, process controls, and statistical data analysis,
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