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Broadcom Analog Mixed-Signal Design Engineer 
United States, California, San Jose 
728144560

17.12.2024

Job Description:

Broadcom is looking for a Principal level high speed analog mixed-signal desgn engineer.

Qualifications include:

  • MS in Electrical Engineering or Computer Engineering with 10+ years of experience in advanced node CMOS high speed analog and mixed signal development or PhD in Electrical Engineering or Computer Engineering with 7+ years of experience in advanced node CMOS high speed analog and mixed signal development.

  • Candidate must have recent design ownership in 5nm and 3nmtechnologies.

  • Experience in designing low jitter, low power PLL, VCO and clocking circuitry in advanced CMOS nodes.

  • Deep understanding of advanced clock distribution techniques such as resonant and traveling wave clocking.

  • Proficiency in electromagnetic tools like EMX or similar.

  • Experience in assessing design bugs and recommending fixes or workarounds to balance technical requirements with schedule.

  • Experience in design management with detailed knowledge of development methodologies, design flows including EDA integration, foundry PDK and associated collaterals.

  • Deep understanding of signal integrity and power integrity for high-speed designs.

  • Good understanding of design tape-out to foundries and solid understanding of supply chain for ASIC product development.

  • System knowledge of current generation and next generation of silicon photonics-based transceiver architectures and standards is highly desirable.

  • Strong analytical thinking and problem-solving skills with excellent attention to details.

  • Must be organized, self-motivated and able to work effectively across internal and end customers teams.

  • Must have excellent knowledge/experience with TSMC 7nm-5nm, i.e. understanding of power consumptions, area, estimated design and layout efforts for digital and analog blocks, technology limitations.

  • It is desirable if the candidate has a good understanding of advanced packaging (2.5D / 3D) architectures.

Highly Desired Qualifications:

  • Strong written and verbal communication skills, with the specific ability to speak to various technical and management levels.

  • Proactive, collaborative and creative approach to innovation, technical development and consensus facilitation to influence optimal project results.

  • Excellent time and task management, and interpersonal skills.

  • Willingness to travel when required.

Compensation and Benefits

The annual base salary range for this position is $141,000 - $225,000.

This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.