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Apple Packaging Substrate Engineer 
United States, West Virginia 
72538223

Yesterday
  • BS and 3+ years of relevant industry experience.
  • MS or Ph.D. and 2+ years of relevant industry experience.
  • Proven fundamentals in the material/chemistry/ or mechanical engineering field(s).
  • In-depth knowledge of substrate technology, manufacturing process, design rules, and roadmap.
  • Hands-on experience in substrate manufacturing and technology development: Cu plating, Lithography, Dielectric material, Laser via formation, and Solder resist.
  • Familiar with package assembly and integration process preferred.
  • Experience in Cadence Allegro platform tools and design review for manufacturing (DFM).
  • Exceptional technology development & project management skills.
  • Strong communication & collaborative skills.
Note: Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program.