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Apple Packaging Substrate Engineer United States, West Virginia 72538223
05.09.2025
- BS and 3+ years of relevant industry experience.
- MS or Ph.D. and 2+ years of relevant industry experience.
- Proven fundamentals in the material/chemistry/ or mechanical engineering field(s).
- In-depth knowledge of substrate technology, manufacturing process, design rules, and roadmap.
- Hands-on experience in substrate manufacturing and technology development: Cu plating, Lithography, Dielectric material, Laser via formation, and Solder resist.
- Familiar with package assembly and integration process preferred.
- Experience in Cadence Allegro platform tools and design review for manufacturing (DFM).
- Exceptional technology development & project management skills.
- Strong communication & collaborative skills.
Note: Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program.
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