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Apple Assembly Integration Engineer United States, California, Cupertino 713679696
13.06.2024
Key Qualifications
- Experience in Semiconductor Packaging field.
- Working knowledge in materials characterization and analysis
- Solid understanding of large FCBGA package, MCM package, 2.5D packaging and 3D packaging technology.
- General understanding of packaging technologies, assembly processes, IC packaging materials, reliability standards, FA techniques, etc.
- Good communication skills that can enable you to work well with internal multi-functional teams and overseas suppliers.
- Ability to work independently and solve projects with minimum supervision.
- Good engineering problem solving skills with strong engineering physics and fundamentals.
- Can use package design softwares, APD, Virtuoso, etc.
- Working knowledge in memory packaging.
- Good program management skill
- BS and 3+years of relevant industry experience
Education & Experience
- BS and 3+years of relevant industry experience
Pay & Benefits
- At Apple, base pay is one part of our total compensation package and is determined within a range. This provides the opportunity to progress as you grow and develop within a role. The base pay range for this role is between $138,900 and $256,500, and your base pay will depend on your skills, qualifications, experience, and location.Note: Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program.
Apple is an equal opportunity employer that is committed to inclusion and diversity. We take affirmative action to ensure equal opportunity for all applicants without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or other legally protected characteristics.
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