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Apple Thermal MQE 
China, Guangdong Province, Shenzhen 
697998770

18.11.2024
Description
Thermal Module Quality Engineers will be fearless leaders capable of working with multi-functional teams to identify risks, explore solutions, reach consensus and implement mitigations as quickly and efficiently as possible. You will evaluate dimensional, functional, and cosmetic challenges through statistical analyses to make data-driven decisions as well as: - Drive quality readiness at the factory for development builds and mass production. Drive all quality issues in development builds to timely closure. - Drive qualification efforts in a wide variety of areas such as metrology, function inspection, cosmetic during module assembly.- Perform failure analysis to understand thermal failure modes and implement preventive measures.- Write, assess, and audit validation tests both internally and at the vendors.- Drive vendor process performance improvements through objective measurements using yield gap analysis.- Drive inspection optimization
Minimum Qualifications
  • MS degree or equivalent experience in Mechanical/Materials/Data Engineering is required, MBA / PhD degree is a plus.
  • Experience with mechanical part development, design, and qualification
  • Knowledgable about current state-of-art production processes of module assembly and inspection
Preferred Qualifications
  • Hands-on experience with performance characterization techniques and reliability testing
  • Experience developing processes quality plans, supplier quality management, inspection solutions, and driving corrective actions/failure analysis efforts
  • Familiarity with GD&T practices, Metrology, PFMEA and tolerance analysis
  • Project management experience and a deep understanding of problem solving tools including design of experiments, FA, and statistical tools.
  • Strong communication skills and passion to learn and adapt to a dynamic environment.
  • Strong big-data analysis skill with multiple tools like JMP/Python/Tableau
  • Knowledgable about heat transfer theory, acoustics analysis, module assembly, AOI, testing, SMT, AI/ML will be a plus