Amazon Sr Product Engineer Project Kuiper 

United States, Washington, Redmond 

686634600

The Role:
As Senior Semiconductor Product Engineer, you will engage with an experienced cross-disciplinary staff to conceive, design, and manufacture innovative semiconductor solutions for Kuiper’s satellite and ground terminal products. You will work closely with internal inter-disciplinary teams and third-party suppliers to drive key aspects of semiconductor product manufacturing, test, qualification, and reliability to meet our customers’ needs. You must be responsive, flexible and able to succeed within an open collaborative peer environment.In this role you will:
• Analyze foundry WAT data from development, corner lots and qual lots.
• Drive test program reviews with design, test and system teams.
• Collaborate with TE and outsource partner in test program bring-up and evaluation.
• Define char plans and corner lots, and then oversee execution of char data collection and analysis at outsource partner.
• Interface between outsource partner and design / test teams to identify bugs, and support fixes during product bring-up.
• Drive test-time reduction by RF-DC and FT-WS correlation and reject-oriented analysis.
• Define qual plans based on evaluation of mission profile and execute to defined qual plans.
• Define test plans and limits for production lots, corners lots, and pre-/post-qualification lots based on system specs, and yield & Cpk targets.
• Identify root cause and drive fixes for any failures reported during qual.Export Control Requirement:

• Bachelor's degree in electrical/communications engineering or related field, or equivalent experience.
• 7+ years of experience in semiconductor product engineering or foundry process operations, preferably in high-volume wireless SoC devices manufacturing.
• Up to 20% domestic or international travel required.

• Masters or PhD degree in Electrical / Communications Engineering or related field.
• Excellent oral and written communications skills.
Strong technical background in one or more of the following:
• RF product development and characterization experience.
• Knowledge of digital and Serdes testing.
• Experience interfacing with suppliers and external partners.
• Proficiency in statistics, data analysis and YMS products such as Exensio and JMP – scripting skills preferred.
• New product introduction, with transition from design phase, through qualification and into high volume manufacturing environment.
• Conversant with failure analysis techniques such as FIB, SEM, IR, EMMI, and CSAM.
• Knowledgeable with package technologies such as FCBGA, FCCSP, WLCSP, and QFN.