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Intel Interconnect Architect 
United States, Texas 
655123559

08.04.2025
Job Description:

As a Interconnect Architect responsibilities will include but are not limited to::

  • Understand performance, power, cost, user experience, form factor, reuse, and compatibility requirements and tradeoffs of platform off-chip interconnects such as PCI Express, CIO (ConvergedIO)/USB4/Thunderbolt,MIPI, UCIe and die to die interconnects and/or wireless interconnect.
  • Set short and long term direction for off-chip interconnects and drive realization of said direction throughout path finding as well as product life cycle.
  • Develop partnerships with IP, SoC, Package/Physical design, firmware, PnP, electrical design and validation teams to drive development of IO interconnect technologies and related features.
  • Participate in industry IO standard forms and drivetechnologies/featuresthat benefit Intel platforms' objectives and business.
  • Document requirements for interconnects in architectural or engineering internal specification documents.
Qualifications:

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:

  • Bachelor's of science in Electrical Engineering, Computer Engineering or a related field
  • 8+ years of experience in platform or IO development

Preferred Qualifications:

  • Master's of science in Electrical Engineering, Computer Engineering or a related field
  • Expertise in one or more fundamental electrical and physical design is required: Signal Integrity, Power Integrity, Power Delivery, RFI/EMC, Package, PCB, and/or system design.
  • Experience with standards such as PCIe, MIPI, USB4/Thunderbolt, UCIe, DP/HDMI, or wireless standards is highly desired
  • Comfortable with working in large teams with global team members and stakeholders
  • Excellent verbal and written communication skills
  • Experience driving interconnect technologies from concept to product is highly desired
  • Track record of influencing IO standards is highly desired
  • Familiarity with protocol layer and SoC fabric is an advantage

Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and orschoolwork/classes/research.

Experienced HireShift 1 (United States of America)US, Oregon, HillsboroUS, Arizona, Phoenix, US, California, Folsom
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