Bachelor's degree in Electrical, Mechanical, Industrial, Materials, or a related engineering field.
8 years of experience in microelectronics packaging (e.g., multi-chip modules, silicon photonics).
Experience with Finite Element Analysis and Computational Fluid Dynamics and programming languages like ANSYS (e.g., APDL, Workbench, Icepak), Flotherm, LS-Dyna, Abaqus, Fluent, Icepak, Matlab, Python.
Experience in thermomechanical reliability and mechanical drop or shock simulation.
Experience with Statistical Software tools (e.g., JMP, Weibull++, SPSS).
Preferred qualifications:
Master's degree or PhD in Electrical, Mechanical, Industrial, Materials, or a related engineering field.
Experience in setting up manufacturing assembly processes, driving product launches and assembly process optimization within manufacturing operations.
Experience in technical leadership, project management, and executive communication.
Experience in Coupled Field/Multiphysics, Thermal-Electric simulations, Fluid-Solid Interaction.
Experience in reliability prediction models, stochastic simulations, uncertainty analysis, multi-scale and multiobjective optimization.