A self-motivated innovator with a strong desire to push the boundaries of technology.
Excellent teamwork and communication skills make you a valuable collaborator. You think outside the box and are always looking for new ways to innovate.
Expertise in electromagnetic simulation tools like HFSS and CST, combined with hands-on experience in high-speed PCB/package development, makes you a technical leader in your field.
Deep understanding of high-speed NRZ and PAM4 Serdes, power integrity design, and lab measurement techniques. Your strong lab skills and measurement experience with tools like VNA, TDR, Real-Time Scope, and BERT set you apart.
MSEE combined with 4 or more years of related experience
Experience working directly with ASIC, package, and system design teams to evaluate design tradeoffs and optimize performance, risk, cost, and manufacturability.
Experience in electromagnetic modeling of complex 3-dimensional structures.
Experience in designing and analyzing gigabit serial links and ensuring compliance with internal specifications and standards.
Experience in generating and verifying package layout rules and performing pre- and post-route signal integrity analysis of ASIC and PCB package designs.
Experience in modeling and analyzing power delivery networks.
Experience in conducting physical measurements to collect data for design validation and simulation correlations.