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Apple Silicon Photonics Design & Packaging Engineer United States, California 582522891
14.04.2025
- BS and 10+ years of experience in relevant industry experience
- M.S or Ph.D. in Physic (Optics major), Electrical Engineering, Materials Science, Mechanical Engineering or an equivalent field desired, preferred.
- Excellent teamwork and communication skills.
- Strong theoretical background in optics and photonics fundamentals, device/module integration
- Hands-on experience in photonic IC (PIC) design, silicon photonics device laser, high speed modulator, PD, passive components, such as Si WG, MUX/DeMUX.
- Hands-on experience in Si photonics packaging and measuring fiber-coupled devices.
- Hands-on experience in optical component design, simulation and qualification, and single / multi-mode fiber assembly using active and passive alignment tool. Hands-on experience of CMOS BEOL wafer scale processing and flip chip assembly (CoC, CoW, WLP)
Note: Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program.
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