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Apple Advanced Package Development Engineer 
United States, California 
519624293

08.06.2025
You will be responsible for Package design and design flow development for advanced packaging technologies in a cross-functional team. Other responsibilities include advanced packaging CAD flow set-up, CAD tool bring-up and related areas.
  • BS and 20+ years of experience in relevant industry experience.
  • 10 years in a Si fab integration role with 5 years in advanced packaging, preferred.
  • PhD in Physics, EE, Mech E, Chemistry, and related fields.
  • Silicon fab interconnect process integration experience in BEoL process, RDL, fine pitch µ-bumps, hybrid bonds, TSVs, etc.
  • Deep knowledge of electrical, mechanical and thermal properties of fab materials
  • Strong expertise in Si Fab equipment and Fab Logistics Management
  • Experience on advanced packaging for leading edge CMOS nodes
  • Expertise on Si structure yield and reliability mechanisms and analyses
  • Good familiarity with electrical, mechanical and/or thermal characterization, failure analysis
  • Tool experience: One or more of TCAD, JMP, Virtuoso, KLayout, Ansys EDT
  • Capable of independent R&D Work in a cross-functional team, driving vendors
  • Excellent communication and people skills
Note: Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program.