You will be responsible for Package design and design flow development for advanced packaging technologies in a cross-functional team. Other responsibilities include advanced packaging CAD flow set-up, CAD tool bring-up and related areas.
BS and 20+ years of experience in relevant industry experience.
10 years in a Si fab integration role with 5 years in advanced packaging, preferred.
PhD in Physics, EE, Mech E, Chemistry, and related fields.
Silicon fab interconnect process integration experience in BEoL process, RDL, fine pitch µ-bumps, hybrid bonds, TSVs, etc.
Deep knowledge of electrical, mechanical and thermal properties of fab materials
Strong expertise in Si Fab equipment and Fab Logistics Management
Experience on advanced packaging for leading edge CMOS nodes
Expertise on Si structure yield and reliability mechanisms and analyses
Good familiarity with electrical, mechanical and/or thermal characterization, failure analysis
Tool experience: One or more of TCAD, JMP, Virtuoso, KLayout, Ansys EDT
Capable of independent R&D Work in a cross-functional team, driving vendors
Excellent communication and people skills
Note: Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program.