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Google IC Package Development Technologist United States, California, San Diego 507108635
Yesterday
Info Note: By applying to this position you will have an opportunity to share your preferred working location from the following: San Diego, CA, USA; Mountain View, CA, USA.Note: By applying to this position you will have an opportunity to share your preferred working location from the following:.
- Bachelor's degree in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, related degree or equivalent practical experience.
- 8 years of experience in semiconductor packaging and technology development.
- Experience with Failure Mode and Effects Analysis (FMEA), design of experiment techniques (DOE), Statistical Process Control (SPC), Defect analysis and data analysis.
Preferred qualifications:
- Master's degree or PhD in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, related degree or equivalent practical experience.
- Experience working on Chip Package Interaction and Electromigration, effect relating to assembly, design, process condition, and reliability conditions.
- Experience in delivering advanced mobile packaging from inception to production, with solving complex problems.
- Experience with Assembly or SMT process.
- Understanding of microelectronic packaging technologies, including flip chip bumping, assembly manufacturing , substrate manufacturing or SMT.
- Knowledge of semiconductor quality and reliability standards and failure modes.
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