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The ideal candidate should exhibit the following behavioral traits:
Influence and work across multiple teams and stakeholders to develop solutions.
Critical performance skills include intolerance of stagnant productivity, a desire to relentlessly pursue root cause and problem elimination, and pride in crisp, flawless execution that is grounded in clear and direct communication and Problem solving skills.
As a Stress Lab Engineer responsibilities will include but not be limited to:
Drives technology development and enablement for both high volume manufacturing and future technology, provides process integration and equipment solutions, and performs feasibility studies to meet desired device specifications.
Leads design and development of technically sophisticated manufacturing processes and/or repair reverse engineering including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements.
Performs pathfinding activities in support of process and hardware development enabling manufacturing of innovative device architectures, and develops roadmaps for technologies enabling future roadmap.
Recommends and implements modifications for operating equipment to improve production efficiency, manufacturing techniques, and optimizing production output for existing products.
Partners with key equipment and materials suppliers to develop and implement enabling elements of the technology.
Performs process technology feasibility studies through theoretical simulations and/or practical engineering methods.
Remains updated on relevant industrial process and material manufacturing technical trends and develops view of inherent future Intel process technology needs to push industry forward by partnering with vendor ecosystem to build cost sensitive roadmap.
See for more details.
Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research. This is an entry level position and will be compensated accordingly.
Minimum Qualifications:
1+ year(s) of experience (or relevant coursework) in at least one of the following:
Technical and analytical problem solving, especially using structured methodology (Lean, Six Sigma, Kaizen, etc).
Data collection and statistical data analysis, especially statistical process control.
Design of experiments, measurement capability analysis, and screening experiments.
Data Based Problem Solving using tools such as SQL Scripting, JMP Statistical analysis.
Hands on experience with equipment and Printed Circuit Board (PCB) troubleshooting / debug utilizing lab instrumentation e.g. Oscilloscopes, Digital Multi Meters, tool schematics and board files
Lab SW Programming or data acquisition Experience examples- High Level Languages (Labview, Python, Java) / Low Level (Assembly, C++), SQL.
Preferred Qualifications:
Knowledge of reliability failure statistics physics, failure mechanisms, and/or assessment methods (experimental and model-based).
Knowledge of transistors, solid-state physics, optoelectronics, MEMS, novel devices, interconnects, dielectrics, semiconductor packaging and/or semiconductor testing and the implications of new packaging technologies to test methods and hardware.
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