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Job Description:
Broadcom is looking for an experienced RFIC and Analog Mixed-Signal Physical Design and Layout Engineer
Qualifications include:
BS in Electrical Engineering, Computer Engineering or related degree preferred with 12+ years of experience in Mixed Signal and Analog RF IC Physical Design or MS in Electrical Engineering, Computer Engineering or related degree preferred with 10+ years of experience in Mixed Signal and Analog RF IC Physical Design.
Experience developing and leading complex layout IC for high speed applications in advanced CMOS FinFET technologies such as 5nm and 3nm at the block level and chip level.
Thorough knowledge of industry standard EDA tools from Cadence, Mentor and Synopsys.
Experience with layout of high-performance high-speed analog mixed-signal blocks such TIAs, CMOS drivers, high-speed Data converters and PLLs.
Experience with floor planning, block level routing and top-level chip assemble
Knowledge of layout techniques such as floor planning, layer generation, thermal aware layout with consideration for electro-migration.
Knowledge of circuit design concepts and IC manufacturing processes.
Understanding of silicon process technologies and device physics.
Experience working with distributed design teams.
Knowledge of skill code and layout automat is a plus.
Self-starter with the ability to define and adhere to a schedule.
Must possess strong written and verbal communication skills.
Highly Desired Qualifications:
Strong written and verbal communication skills, with the specific ability to speak to various technical and management levels.
Proactive, collaborative and creative approach to innovation, technical development and consensus facilitation to influence optimal project results.
Excellent time and task management, and interpersonal skills.
Willingness to travel when required.
May manage resources to achieve group objectives
Compensation and Benefits
The annual base salary range for this position is $141,000 - $225,000.
This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.
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