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Apple IC Packaging Integration Engineer United States, California 479655871
21.04.2025
-You will be responsible for IC packaging development -Work with cross-functional teams and lead SoC Package integration and architecture efforts -Drive the industry with advanced package solutions, new material developments, and specs
- BS and 10+ years of experience in relevant industry experience
- MS/PhD and 6+ years of experience in relevant industry
- We are looking for someone experienced in the semiconductor packaging and/or system integration.
- Good understanding of multi-functional packaging areas: package layout and architecture, enabling process technologies, thermal, mechanical, SI/PI, material, component & system level reliability, testing, FA and package-system integration
- Specialist in advanced packaging technologies: Knowledge and insight to deliver high density / high performance interconnects in various form factor, thermo-mechanical, reliability, and cost constraints
- Excellent problem solving with strong physics and fundamentals
- Excellent communication skills that enable the candidate to work well with internal cross functional teams and overseas suppliers
- Basic knowledge of signal integrity/power integrity
- Ability to review schematics, package/PCB layout and designs in Allegro
Note: Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program.
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