Nvidia IC Reliability Engineer 

United States, California 

475348346

What you will be doing:

• Reliability (DfR) qualification and testing for various packaging including GPU/CPU, power model, memory IC, wifi module and etc.

• Work with design and operations teams to create board and system reliability test plans for various products such as GPU, Server, Automotive, Gaming, and Embedded;

• Develop and assess reliability for electrical failures related to high-speed signal, power devices and connectors;

• Develop and assess reliability for various mechanical components and latest thermal cooling technologies;

• Coordinate and conduct packaging reliability testing in internal and external laboratories;

• Work with suppliers and partners to perform reliability qualification of third party’s key components including memory, regulator, power IC and connectors;

• Model field RMA data as compared to testing data;

• Perform FEA to assist PCBA and system mechanical structural design;

• Analyze and track failure patterns of various interfaces inside packaging.

What we need to see:

• MS/Ph.D. in related fields such as physical engineering, mechanical, materials and electrical engineering (or equivalent experience)

• Minimum of 4 years working experience in reliability engineering related to electronic packaging and modules

• Knowledge using DfR and FEA tools is desired

• Strong familiarity with statistics and reliability mathematics

• Familiar with electronic packaging, reliability testing and failure analysis

• Familiar with reliability requirements for various IC packages

• Knowledge of failure analysis for electronics products and components

• Must be able to work independently with minimal supervision and drive projects to conclusion in an efficient and effective manner

• Quick thinking, good decision making and problem-solving skills

• Self-motivated, patient, desire to take challenges with good communication skills (written and oral). Ability to provide updates to senior management clearly and concisely.

Ways to stand out from the crowd:

• Track record of successful project execution in the packaging process, reliability testing and modelling.