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Intel Global Yield Defect Metro Engineer Ireland 457200531
This job is to seek for Defect Metro Development engineering roles in FSM HVM Global Yield organization, reporting to Defect Metro Engineering Development manager.
Selected candidates will:
Work with other members in defect metro team, other teams in Global Yield org, fab module, yield, integration, and TD team members to achieve yield ramp-up and defect reduction in early production stage, supporting internal and external customers.
Collaborate with Technology Development team and Process Integration team to import and setup new technology to production fabs across the globe.
Identify critical yield limiting defect steps and work with Defect Control team to set production line inspection strategy to protect yield and quality at maximum productivity and lowest cost.
Candidate should possess the following
behavioral skills:
Problem-solving and project/program management experience with strong self-initiative and self-learning capabilities.
Demonstrated interpersonal skills to perform at leadership role including influencing, engaging, and motivating.
Proven track record of working across organization through matrix structures to accomplish strategic objectives with conflicting priorities.
Must demonstrate strong communication skills.
MinimumQualifications:
Bachelor's degree in science and engineering major, with at least 5-8 years of experience.
Strong understanding on defect mechanism and yield impact in semiconductor high-volume production and proven quantified track record of driving down D0.
8+ years of experience in advanced node semiconductor industry in Defect engineering.
Basic understanding and collaboration experience with processes including lithography, dry etch, wet etch, CMP, diffusion, implant, thin films and metrology
In addition :
Experience in Statistics and Machine Learning preferred.
Experience in working with Process Integration, Design and OPC teams to identify layout-sensitive defect weak points and address systematic defect issues.
Knowledge of module tool impacts to defects, inline parametric and yield through PM life while understanding upstream and downstream impacts to other tools
Experience in FinFET technology development or high-volume manufacturing with hands-on knowledge of FinFET technology process flow to analyze systematic defect sources and set mitigation actions.
Working knowledge in module processes including lithography, dry etch, wet etch, CMP, diffusion, implant, thin films and metrology. Skills to develop improvement projects at module level to improve process for reduced defectivity and improved yield.
PreferredQualifications:
Advanced degree (Master's or Ph.D.) in Electrical Engineering, Physics, Chemistry or Materials Science major is preferred, with at least 5 years of experience.
Experience in project/program management and/or Task Force Team lead.
Must demonstrate solid communication skills.
Ability to work with multi-functional, multi-cultural teams.
Demonstrated interpersonal skills including influencing, engaging, and motivating.
Problem-solving technique with strong self-initiative and self-learning capabilities.
Ability to leverage big data analysis to identify process design weaknesses and/or manufacturing weaknesses to propose corrective, data-based solutions.
Ability to extracts insights from structured and unstructured data by quickly synthesizing large volumes of data and applying statistics and machine learning.
Experience in new semiconductor technology development.
Experience in serving external Foundry customers through technical interactions.
Experience in GAA (Gate-All-Around) technology architecture.
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