Bachelor’s degree in Engineering, Science, or equivalent practical experience.
5 years of experience in Micro Electro Mechanical Systems (MEMS)/semiconductors advanced packaging including design, development, and testing.
3 years of experience in people management.
Experience in package techniques including 3D integration, wire bonding, bump bonding, land grid array, through-silicon vias, spring contacts, micromachining, and related characterization of reliability and yield.
Preferred qualifications:
Experience leading high-precision research and development packaging development team and projects.
Experience with cryogenic vacuum environments, thermal cycling, and related challenges.
Experience building and managing vendor supply chains.
Experience with microwave devices such as transmission lines, waveguides, resonators, or antennas.
Experience with superconducting circuits or quantum computing hardware such as superconducting qubits, spin qubits, or trapped ions.