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Google Chip Packaging Engineering Manager United States, California, Sunnyvale 38021734
Yesterday
Minimum qualifications:
Preferred qualifications:
- Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
- 10 years of experience with package development for high volume production.
- 3 years of industry experience in engineering management.
Preferred qualifications:
- Master's degree or PhD in Electrical Engineering, Computer Engineering or Computer Science, with an emphasis on computer architecture.
- Experience in the thermal and mechanical modeling of silicon packaging.
- Experience with the qualification process for advanced silicon packaging.
- Familiarity with general package assembly process, packaging materials, and reliability requirements (component and board level).
- Knowledge in 2.5D and 3D packaging technologies for high performance computing.
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