ARM Staff Thermal Analysis Engineer 

United States, California, San Jose 

380032174

Job Overview:

Responsibilities:

· Work closely with physical design team, power integrity and package teams to model thermal performance of SoCs with a particular focus on on-die hotspots. This will apply to monolithic design as well as multichip solutions including 3DIC.

· Develop guidelines for optimization of SoC floorplanning and packaging technology to reduce the temperature variation across an SoC.

· Work with system-level thermal tools and partners to further develop strategies that reduce temperature excursions in Arm SoC designs.

· Identify, model and quantify the thermal benefits of various system approaches to help our team better understand the thermal constraints in systems. This would be in both steady-state and transient analyses.

Required Skills and Experience:

· Bachelors, Masters, or Ph.D. degree in Electrical Engineering or Mechanical Engineering, with a strong computer architecture and thermal performance background

· Minimum 2-3 years of experience in performance modeling and analysis of SoC systems with emphasis on thermal performance. Work experience in mobile and/or laptop cooling is a plus.

· Proficiency in thermal analysis tools like Cadence Celsius, Ansys RedHawk-SCET or Ansys Icepak

· Excellent interpersonal skills, strong initiative and open in engaging and learning new concepts and sharing with collaborators.