Amazon Sr Thermal & Mechanical Engineer Annapurna Labs 

United States, Texas, Austin 

376705376

As a member of the Machine Learning Acceleration team you’ll be responsible for the design and optimization of hardware in our data centers. You’ll provide leadership in the application of new technologies to large scale server deployments in a continuous effort to deliver a world-class customer experience. This is a fast-paced, intellectually challenging position, and you’ll work with thought leaders in multiple technology areas. You’ll have high standards for yourself and everyone you work with, and you’ll be constantly looking for ways to improve your products performance, quality and cost. We’re changing an industry, and we want individuals who are ready for this challenge and want to reach beyond what is possible today.Key job responsibilitiesAustin, TX, USA

- BS or MS degree in Mechanical/Thermal Engineering
- 10+ years industry experience in Mechanical and Thermal design of Systems
- Experience in thermal and performance measurements and characterization on SoCs, Servers, and Systems
- 3+ years of experience SoC Thermal modelling and IC package transient thermal response
- Experience with Chip package, System Mechanical & Thermal design for air-cooled and liquid-cooled systems
- Collaborate effectively with teams spanning multiple sites and develop detailed specifications for product teams to use
- Work with ODMs, heatsink vendors, and internal design teams on cross-boundary triaging, debugging, and resolving issues across organization.

- Knowledge of SoC thermal/mechanical design methodology, power modeling and thermal analysis techniques
- Tool Familiarity: Ansys Icepak, FloTherm, Cadence Celsius, PTC Creo, and Solidworks
- Programming experience: Bash script, Shell script, Linux, Python, and Lua. Familiarity with working in Linux environment is an added advantage
- Working knowledge on fans, valves, chillers, and CDUs
- Knowledge of various types of technologies used for Heatsink solutions, Thermal Interface Materials (TIMs) and liquid cooling technologies
- Develop detailed CFD and compact RC models for SoC and Package thermal analysis
- Knowledge of hardware and software based thermal / power management control algorithms
- Optimize thermal solutions under PPA and system design constraints
- Simulate and prototype thermal control strategies
- Validate thermal models through power/thermal measurements on Hardware