Nvidia Manufacturing Process Engineer 

United States, California 

366308661

What you’ll be doing:

• Drive manufacturing engineering requirements and standard processes at vendors and contract manufacturers.

• Develop SMT processes to scale new products, including mechanical fixture design.

• Collaborate closely with contract manufacturers (CM)to ensure on-time builds execution and champion process improvements and tool development to address workmanship issues.

• Provide DFX feedback and collaborate with multi-functional teams to improve final product yield, reliability, and ensure robust design for manufacturing.

• Ensure mass production launch readiness and provide feedback to optimize PCBA process.

• Establish and implement critical-to-quality process control measures, including manufacturing limits and critical Process Control Indicator (CpK).

• Monitor SMT process data critical metrics for New Product Introduction (NPI) and mass production (MP) builds, driving suppliers to corrective action to meet established six sigma quality goals.

• Plan and implement advanced Research and Development programs and DOE’s as required to achieve and exceed product performance and customer Reliability requirements.

• Collaborate with Contract Manufacturers (CM) and Original Design Manufacturer (ODM) efficiently implementing new materials and technologies, and review and improve manufacturing practices and processes at the assembly and system levels, ensuring significant improvements in quality and reliability.

What we need to see:

• BS/MS or equivalent experience inElectronics/ElectricalEngineering, Mechanical Engineering, or related field.

• Minimum 5+ years of Proven experience in a Manufacturing Process Engineering role.

• Extensive expertise in all PCBA Technologies and Manufacturing with a strong background in Quality and Supplier Management.

• Experience with temperature profiling process to achieve optimum solderability.

• Experience in Surface Mount Technology (SMT), wave soldering, and Backend Processes including boards and systems assembly and test.

• Knowledge and understanding of solder alloy materials, SPI, AOI, X-Ray inspection machines, Routers (mechanical & laser), Press-Fit mechanical process, and Rework Processes per IPC7711/7721.

• Background of dispensing systems and processes (corner bonding, underfill, heat staking, ultrasonic welding, adhesives…) is a plus.

• Knowledge of Process Flow, Process Control Plan, and Process FMEA is a plus.

• Willingness and ability to travel within the North America region.

Ways to stand out from the crowd:

• In-depth knowledge of industry specifications and requirements.

• Ability to be a self-driver with minimal supervision.

• Excellent communication and organization skills, good time management and task prioritization.

• Strong problem-solving and conflict resolution skills.

• Hands-on and management experience with SMT Assembly processes in a manufacturing environment.