Who You AreYour role will also be to drive component failure analysis, containments, and root cause corrective actions and to work with development/manufacturing engineering and management representatives to resolve sophisticated technical problems. You will also be responsible for driving product qualification and burn in testing to JEDEC specs. You should have shown the ability to perform statistical data/yield/correlation analysis on large data sets from wafer sort to system final test to find yield issues and drive test and yield optimization.
What You'll DoYou will join the Quality and Reliability organization as ASIC Reliability Engineer and lead all aspects of product qualification including Failure analysis of complex ASIC products. This role will require high level of collaboration and interaction with Product Test Engineering, Design Engineering, Quality Engineering, Assembly Engineering and Foundry Engineering teams as vital. Must be able to work well within a team and have excellent communication and interpersonal skills. Should have experience completing IC Reliability Qualifications for NPI and advanced process and package technologies.
- Own reliability test plans for new products, including sample testing and full qualification prior to volume production release.
- Perform reliability evaluation of IC products, packages, and process technology with focus on suitability to end applications and conformance to industry standards.
- Coordinate and conduct reliability testing, and Failure analysis for Silicon One ASICs in internal/external laboratories.
- Support HTOL, biased HAST and ESD/LU bring-up and debug for reliability qualification and evaluation.
- Lead failure analysis investigations using structured problem-solving methods to engage a multi-functional team to diagnose, resolve, and prevent future problems.
- Conduct Root cause analysis of reliability tests or field failures and propose corrective actions.
- Perform drift analysis and Analyze reliability results, device parameter trends and apply acceleration models to predict reliability in the field.
- Evaluate and perform reliability risk assessment.
- Work with design, foundry interface, package, test, and product engineers to qualify new processes and package technologies to ensure quality of design performance to meet customer reliability requirements.
- Issue internal and external product qualification and FA reports.
- Knowledge of JEDEC and other industry standard IC Qualification tests
Minimum Requirements:- Bachelor’s in electrical engineering or related field.
- 7+ years’ experience in Semi IC Reliability engineering/ Failure Analysis with hands-on experience in 1 or more related areas such as Product Engineering, Test Engineering, Process/Assembly Engineering.
- 5+ Experience with Semiconductor, manufacturing process, IC test methodologies, device reliability, silicon/package fail mechanisms and symptoms.
- 5+ years' experience in Statistical data analysis, ATE test data interpretation, device level electrical characterization, and IC failure analysis.
- Experience of FA techniques like Cross sectioning, X-ray, CSAM, TDR, FIB, SEM, and TEM is a plus.
- CRE/ASQ Certification would be a plus.
- MSEE (or higher) in Electrical Engineering.
But “Digital Transformation” is an empty buzz phrase without a culture that allows for innovation, creativity, and yes, even failure (if you learn from it.)