Microsoft Manufacturing Engineering Engineer 

Taiwan, New Taipei, New Taipei 

322555833

Microsoft Silicon, Cloud Hardware, and Infrastructure Engineering (SCHIE) is the team behind Microsoft’s expanding Cloud Infrastructure and responsible for powering Microsoft’s “Intelligent Cloud” mission. SCHIE delivers the core infrastructure and foundational technologies for Microsoft's over 200 online businesses including Bing, MSN, Office 365, Xbox Live, Teams, OneDrive, and the Microsoft Azure platform globally with our server and data center infrastructure, security and compliance, operations, globalization, and manageability solutions. Our focus is on smart growth, high efficiency, and delivering a trusted experience to customers and partners worldwide and we are looking for passionate, high-energy engineers to help achieve that mission.

As Microsoft's cloud business continues to grow the ability to deploy new offerings and hardware infrastructure on time, in high volume with high quality and lowest cost is of paramount importance. To achieve this goal, the Hardware, Infrastructure Management, and Fundamentals Engineering (HIFE) team is instrumental in defining and delivering operational measures of success for hardware manufacturing, improving the planning process, quality, delivery,and sustainability related to Microsoft cloud hardware. We are looking for seasoned engineers with a dedicated passion for customer focused solutions,and industry knowledge to envision and implement future technical solutions that will manage andthe Cloud infrastructure.

Manufacturing engineering & Systems Integration Engineerto join the team.

SCHIE HIFEbusiness managers, and supply chain managers to ensure that the newest hardware that powers Microsoft’s cloud services is available to our customers on time and at the highest levels of quality. A critical function in this workthe newest hardware developed by Microsoft is built at our supplier’s factories with efficiency, safety, and at the highest levels of quality.manufacturing.

, liquidand manufacturing of products that coverCompute and GPU based AI workloads to join our team and take part in our vision to empower every person and organization on the planet to achieve more with Microsoft’s technology.

Required Qualifications:

• B.S. / M.S inElectricalEngineering orrelatedEngineering, Mfg. Product Engineering,ME,Mfg.,ASIC,server product design,PCBA/large system design,manufacturingorvalidation.

• At least7years of experience preferred or up in ASIC/CPU/GPU/DPUsystemserver related.

• Experience in ASIC or Cloud server systems hardware design and integration

• Experience as an AE or FAE of ASIC/CPU/GPU/DPUor ASIC/SOC design related.

• Strong understanding of manufacturing processes and equipment.

• Experience with Stencil design for new chipset designs.

• from L3~L11

• Experience in PCBA design or manufacturing process

• Knowledge of server manufacturing, mechanical,thermalandcooling design, power consumption, airflow and hands-on experience in power, airflow,consumptionand power quality measurements.

• Self-motivated, detail-oriented individual must be able to work collaboratively inateam environment and across internal divisions and industry (OEM, ODM).

• Knowledge and experience with Microsoft Server

• Excellent written and oral communication skills

• of materials and change control andreview.

• Able to read and familiarize mechanical drawings design and specificationsincluded PPAP.

• Ability to work in a fast-paced environment and meet tight deadlines.

• Strong problem-solving skills and attention to detail.

• Experience in using Creo software.

• Familiar with liquid cooling infrastructure and its manufacturing process in L10 and L11

Additional Skills and Qualifications

• Experience with industry standard benchmarks: SPEC power, IO-Meter, IPC, JEDEC

• Nvidia,Intel, AMD and ARM system and ASIC/CPU/GPU architecture

• Valor, Creo and Cadence Allegro software knowledge

• with Mechanical parts or tooling parts design review for Server orlarge system.

• Stencil design review for new chipset designs

• Data Center and Cloud Hardware / MFG / Networking Experience

• /PFMEA/Pre-DFx/ In-buildDFx/Post-buildDFxcapabilities, E2E NUDD analysis

• Manufacturing automation/Data collection and display/AIoTexperience is a plus.

• Knowledge of welding, machining, die-casting, buried tube technology and experience in coil, cold plate, and pumping mechanism qualification.

• dentifyandevaluatepackagingmaterials, whichcomply witheco-friendlyobjectivesis a plus.

• Lead packaging design optimization activities to form a cost-effective solution without sacrificing qualityis a plus

Manufacturing Engineering work.Supporting manufacturing needs from prototypes to end of life.ME. Eng. alsobe responsible forand executing power, power design quality and thermal validation testing.

• Ability toreview and implementmanufacturing processes and design review (DFx)from L3~L11 (E2E)

• PCBA/ Clouds system/ Manufacturing processes including tooling/fixturing and production line development for high-volume.

• Experience inPower/PCBA/Compute/Storage/GPU/AIsystemdesigning, testing, and troubleshooting liquid coolingand thermalsystems for electronics or other devices.

• Knowledge of thermodynamics, fluid mechanics, heat transfer, electronics, and computer hardware.

• Work with the IC design manufacturing team to implement new ASIC or CPU/GPU into our new Cloud server design for AI or Cloud computing.

• Collaborate with other departments to ensure manufacturing processes are efficient and effective.

• Create reference guidelines for new chipset designs.

• Work with cross-functional teams to develop and execute product manufacturing plans.

• Conduct research to improve existing manufacturing processes.

• Create andmaintaindocumentation related to manufacturing processes.

• Evaluates manufacturing assembly processes by designing and conducting research programs; applying knowledge of product design, fabrication, assembly, tooling, and materials; conferring with equipment vendors;solicitingobservations from operators.

• Develops manufacturing processes by studying product requirements; researching, designing,modifying, and testing manufacturing methods and equipment; conferring with equipment vendors.

• Improves factory production efficiency by analyzing and planning workflow, space requirements, and equipment layout.

• Assures product and process quality by designing control systems, testing finished- product and process capabilities;establishingstandards; confirming manufacturing processes.

• Provides manufacturing decision-making information by calculating production, labor, and material costs; reviewing production schedules; estimating future requirements.

• product and process reports bycollecting data, analyzing, and summarizing information and trends.

• Provides manufacturing engineering support by providing clear requirements and expectations.

• complying withgovernment regulations.

• Evaluating printed circuit board assembly and system assembly factories to ensure the correct control systems are in place to produce consistent quality and repeatable results.

• Work with Microsoft’s System Integrators to supervise and review (1) Power and Airflow Testing and (2) Power Quality Testing for MSFT cloud server infrastructure. The candidate will be qualifying for hardware SKUs and systems todemonstratehow servers willoperateunder a range of conditions that would be expected throughout their useful life in a Microsoft data center.

• Maintains professional and technical knowledge by attending educational workshops; reviewing professional publications;establishingpersonal networks;participatingin professional societies.

• Overall maximizingmanufacturingefficiencies andprocessquality control in every way.