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Google Advanced Manufacturing Engineer Metallurgy Google Cloud 
Taiwan, Taipei, Taipei 
295770099

19.11.2024

Minimum qualifications:
  • Bachelor's degree in Electrical, Mechanical, Chemical, or equivalent practical experience.
  • 10 years of experience in manufacturing, or process development in semiconductor packaging and SMT.
  • Experience in advanced IC packaging qualifications, metallurgy, thermal dynamics, and Design of Experiments.
  • Experience in microstructure, material characterization, solder alloy, Indium, and Copper interconnect long-term reliability.

Preferred qualifications:
  • Master's degree in Electrical, Mechanical, Chemical, or related disciplines.
  • Understanding of industry trends, emerging technologies, and competitive dynamics within the field of solder alloys and STIMs.
  • Demonstrated record of delivering robust innovative manufacturing solutions, leading failure analysis investigations and resolutions, and overseeing yield improvements for high complexity products.
  • Expertise in designing and conducting experiments to evaluate material properties, performance, reliability, and compatibility with various packaging substrates and components.
  • Excellent communication and investigative skills, able to collaborate with multi-geo teams on complex projects spanning multiple technologies.