Bachelor's degree in Electrical, Mechanical, Chemical, or equivalent practical experience.
10 years of experience in manufacturing, or process development in semiconductor packaging and SMT.
Preferred qualifications:
Master's degree in Electrical, Mechanical, Chemical Engineering.
Experience designing and executing experiments to evaluate material properties, performance, reliability, and compatibility with various packaging substrates and components.
Understanding of industry trends, emerging technologies, and competitive landscape in solder alloys and sTIMs.
Excellent communication and analytical skills, including ability to collaborate with multi-geo teams on complex projects spanning multiple technologies.
Demonstrated record of delivering robust innovative manufacturing solutions, leading failure analysis investigations and resolutions, and overseeing yield improvements for high complexity products.