

NVIDIA has been transforming computer graphics, PC gaming, and accelerated computing for more than 25 years.a unique legacy of innovationfueled by great technology—and amazing people. Today,
What you will be doing:
Partner with Design Engineering to drive the end-to-end roadmap for PCB and PCBA technologies across all NVIDIA product lines, from early R&D through mass-production readiness.
Lead strategic sourcing, quality, delivery, and commercial management of the global PCB supply base, ensuring capability, resilience, and readiness for rapid growth.
Develop and implement technical plans and programs that advance PCB and PCBA technologies in both the short and long term, ensuring suppliers have the capacity and capability to support mass-production volumes.
Plan and execute advanced R&D programs for next-generation PCB and PCBA/SMTtechnologies includingmaterials, interconnect structures, and assembly processes to achieve high yields, strong reliability, and readiness for Data Center, Networking,Gaming, and Automotive products.
Partnerclosely withU.S. and Israeli Hardware and Signal Integrity teamsto anticipate andsupport PCB, PCBA, and SMT requirements early in the design cycle.
Partner with leading PCB fabricators and material suppliers to shape next-generation technologies, guidetheir development roadmaps,and qualify new processes and materials for reliable mass production.
Select, pre-qualify, secure capacity,and allocate marketshare for PCB suppliers across NPI and mass-production demands.
Manage all engineering and NPI quick-turn PCB/PCBA builds, ensuring industry-leading cycle times, quality, and predictability.
What we need to see:
B.S. or higher in Materials Science, Chemistry,Electrical Engineering,or related technical discipline or equivalent experience.
20+ overall years of experience across PCB and PCBA/SMT technologies, including at least 10 years leading large, global, cross-functional engineering or manufacturing technology organizations.
Demonstrated mastery of PCB technology development including laminate systems, interconnect structures,HDI/multilayer stackups,fabrication processes, and reliability engineering.
Strong hands-on background in PCBA and SMT manufacturing, including solder materials, adhesives, underfill, thermal materials, stencil and reflow processes, DFM/DFT, SPC, FA, and high-reliability assembly.
Proven experience managing and developing global PCB supply bases, including technology roadmaps, qualifications, quality programs, capacity strategies, and supplier performance management.
Experience supporting high-reliability markets (Automotive, Aerospace, Defense, Medical) with rigorous process control and reliability requirements is a strong plus.
Established ability to partner deeply with Hardware, Signal Integrity, and Reliability Engineering teams, both domestic and offshore, with a track record of solving complex design-to-build challenges.
Demonstratedsuccess operating atexecutive scale strong leadership presence, clear communication, decisive problem solving, and the ability to influence senior stakeholders across Engineering, Operations, and Suppliers.
A builder’smindset with highmotivation, strong analytical thinking, creativity, and a passion for developing newtechnologies andelevating global manufacturing capability.
the technologya challengeand help us build the scalable communication platforms driving our success in this multifaceted and quickly growing field.
You will also be eligible for equity and .
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