Amazon Sr IC Packaging Design Engineer Project Kuiper 

United States, California, San Diego 

267705323

The Role:
As Senior IC Packaging Manufacturing and Reliability Engineer, you will engage with an experienced cross-disciplinary staff to conceive and deliver innovative product IC package solutions. You will work closely with an internal inter-disciplinary team, and third party suppliers to drive key aspects of product definition, execution and optimization. You must be responsive, flexible and able to succeed within an open collaborative peer environment.As a member of the packaging team, you will be responsible for package definition, manufacturing and reliability for mm-wave beamforming SoCs and front-end modules. Strong focus will be on creating the most reliable, lowest cost package for a given system use case.In this role you will:
• Drive IC packaging design and manufacturing from NPI to volume production
• Drive production yield improvement through regular review of supplier key process parameters
• Work with package vendors to define package architecture options, BOM selection, and design rule libraries
• Generate packaging drawings and a set of standard package assembly operating procedures required at NPI and production stages
• Engage material, substrate and OSAT vendors to drive roadmaps, and identify technology candidates to reduce cost and improve package performance
• Define detailed package reliability test plans, based on applicable acceleration models and expected use-case conditions
• Define and drive package qualifications, including MSL, BHAST, HTS, TC, and BLR
• Troubleshoot package qualification and manufacturing issues, drive root cause failure analysis, and lead issues to resolution
• Define key performance indicators, and perform deep-dive audits at vendor sites (assembly, substrate, raw materials) to down-select candidates and/or drive issue resolution
• Analyze cost/performance trade-offs for various package architectures, including FCBGA, FCCSP, FOWLP, WLCSP, etc.
• Collaborate with the antenna, EE and mechanical teams to design and layout test vehicles and application PCBs for your packagesExport Control Requirement:

• Bachelor's degree in Engineering (Materials, Chemical, Mechanical) or other technical fields
• 7+ years in manufacturing full-custom packages for high performance chips
• Proven track record of delivering complex IC packages from design through to volume production
• Understanding of package material properties related to high-volume production and reliability: temperature cycling, HAST, shock, vibration, thermal resistance, outgassing, etc.
• Experience with package qualification, manufacturing, and continuous improvement

• Advanced degree in Engineering (Materials, Chemical, Mechanical) or other technical field
• 10+ years in manufacturing full-custom packages for high performance chips
• Proven track record of supporting products through volume production
• Strong understanding of package design, roadmaps, and manufacturing, and experience on-boarding new manufacturing partners (assembly, substrate, raw materials)
• Experience delivering various package technologies, including FCBGA, FCCSP, WLCSP, FOWLP packages
• Experience with working with OSAT suppliers and drove packaging issues to closure
• Well versed in package qualification test methodology, acceleration model definition and failure analysis
• Strong written and verbal skills