Intel FSO Integration Engineer 

United States, Oregon, Hillsboro 

25453093

Job Description:

FSO OR Integration Engineers are responsible for the following duties:

• Ownership of the process heath and product quality of the FBE manufacturing line.
• Work with process modules to design, execute, and analyze experiments to sustain and improve the processes.
• Ownership of critical projects that span high volume manufacturing, process development, and fab-assembly package integration.
• Monitor and respond to end of line yield trends and execute baseline process changes.
• Defect Layer Owner Responsibilities - partner with Defect Metrology tool and system owners to identify and detect yield impactive defects, implement charts, limits, and lot/tool responses for OOCs.
• Must support Focus teams and Task forces by running experiments, analyzing data, and managing experiment logistics.
• Independently own projects and presentations to management.
• Collaborate with senior engineers in the group to play a key role executing process change implementations.
• Effectively work in a highly networked, cross organization role.
• Must be able to extract, analyze, summarize, and present data with recommendations.
• 24x7 on-call response (as part of an engineering rotation) to respond to urgent line issues, excursions, or to support task force-level projects.

The ideal candidate should exhibit the following behavioral traits:

• Learn new processes and flows.
• Make technical decisions and provide technical direction.
• Demonstrate strong listening, written, and verbal communication skills.
• Demonstrate effective communication up and down the organization, including skills to communicate technical issues and status to factory and program leadership.
• Evidence of organizational and planning skills for engineering projects.
• Team building skills.

Qualifications:

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and orschoolwork/classes/research.

Minimum Qualifications:

• Bachelor’s degree in Physics, Chemistry, Materials Science, Electrical Engineering or related field and 4+ years of experience in a semiconductor manufacturing processing.
• OR Master’s Degree in Physics, Chemistry, Materials Science, Electrical Engineering or related field and 3+ years of experience in a semiconductor manufacturing processing.
• OR PHD in Physics, Chemistry, Materials Science, Electrical Engineering or related field and 1+ year of experience in a semiconductor manufacturing processing.

Preferred Qualifications:

• Experience in a technical leadership role
• Experience with Integration, Defect Metrology, and / or Layer Owner Experience

Experienced HireShift 1 (United States of America)US, Oregon, Hillsboro
Position of Trust

Weoffer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here:

Annual Salary Range for jobs which could be performed in the US: