מציאת משרת הייטק בחברות הטובות ביותר מעולם לא הייתה קלה יותר
What You Will Be Doing:
Manage BOM supply chain and optimize sourcing solutions for best capacity and cost
Bring new products and new technologies to high volume manufacturing
Deliver datamation solutions for enhanced decision making
Manage supplier performance evaluation matrix and keep it updated based on changing business needs
Drive continuous improvement in manufacturing yield, cycle time and product quality/reliability
Lead change control through qualification and notification
Lead non-conforming material disposition and problem solving
What We Need To See:
Master’s degree or higher in Engineering or Science with emphasis on Mechanical, Materials Science, Chemical Engineering fields (or equivalent experience); Business management degree preferred
12+ year validated experience in Flip Chip semiconductor packaging design, process and materials development. Direct experience in advanced assembly technologies such as 2.5D/3D packaging- photonics packaging experience is a plus
Solid technical knowledge of materials, process, package design and equipment technologies in substrate, bumping, and chip assembly
Strong skills in project management and supplier management
Good understanding of quality control, statistics process control, gage R&R and DOE techniques
Good knowledge of packaging industry and its supply chain
Excellent communication skills
Working with multi-functional teams across the world
You will also be eligible for equity and .
משרות נוספות שיכולות לעניין אותך