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IBM Packaging Eng – First Level Design Engineer India, Karnataka, Bengaluru 186763599
22.07.2024
This Package Team is currently looking to fill a position that requires strong fundamentals in System-in-Package (SiP) design, signal and power integrity, and package technology with a high level of analysis and design skills. The ideal candidate will show independence and the ability to be a self-starter.
Job Duties:
- Work with stakeholders and others in a multidisciplinary team to design, analyze and develop 1st level semiconductor packaging that will be used in the next generation of power server systems.
- Co-designing and optimizing the placement of and interface to chips, active and passive components, and the 2nd level packaging card.
- Ensure that the package design connectivity precisely interfaces with the chips and 2nd level packages.
- Ensure that the 1st level package design complies with the physical, electrical, and power constraints of a larger system.
- Work with multiple individuals and teams to optimize a quality design for performance and cost while adhering to a schedule.
- The ability to use Cadence design and analysis tools such as Advanced Package Design (APD), Allegro System Architect (ASA; aka System Connectivity Manager SCM) and Sigrity Power DC.
- The programming skills needed to develop in-house tools to process data and design substrates.
- As a core member of the package team, you will be expected to work autonomously and deliver on project phases on time and on budget. We will help you achieve your goals by continuous professional development and regular career progression sessions.
- We encourage you to continuously develop your skills to meet dynamic changes in the industry.
Required Technical and Professional Expertise
- Bachelor in Engineering – Electrical or Electronics
- 5+ years System Design and/or Packaging Experience
- Experience using package design/editor physical design tools.
- Demonstrate communication skills in a cross functional Development team environment.
- Understand the development process from concept to product qualification.
- The candidate must be able to identify problems, develop and execute action plans, and respond quickly to changing specifications and requirements.
- In addition to demonstrated technical knowledge, the ideal candidate should demonstrate interpersonal communication, creative problem solving, and team building skills.
- Basic programming and scripting experience (writing and/or modifying Perl, Python, JavaScript, Excel and working knowledge of GIT) is highly desired.
- Proficiency in physical design using Cadence Allegro is highly desired.
- General understanding of signal and power integrity
Preferred Technical and Professional Expertise
- Master in Engineering – Electrical or Electronics
- Detailed understanding of Cadence APD (Advanced Package Designer) CAD software and Sigrity Power DC
- Strong understanding of PCB and packaging design
- Understanding of enterprise level system server and processor architecture
- Strong understanding signal and power integrity
- Deep understanding of Physical Design and ability to ensure PD requirements are met (logic, electrical, etc.)
- Expert knowledge of Microsoft Excel spreadsheet manipulation
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