Texas Instruments Packaging Engineer 

United States, Texas, Dallas 

164901119

As a member of our Flip Chip packaging team, you'll have the chance to interact with many product groups and functions. You'll have high visibility on your projects, with strong opportunities for growth both within our team and across the Packaging Technology Solutions organization.
Responsibilities may include:

• Develop new requirements for Flip Chip CSP (FCCSP) packaging and bump process development and maintain quality of existing packages for Automotive, Industrial, Aerospace & Defense, Mobile and Enterprise applications
• Define FCCSP assembly and bump process requirements based on customer requirements and end applications
• Develop new bump and flip chip packaging technologies and process qualification programs
• Perform integrity analysis of bump and flip chip packaging technologies utilizing appropriate tools
• Perform bump and flip chip package technologies characterizations including cost effectiveness studies
• Act as a liaison with OSATs (outsourced assembly test sites), internal assembly sites and material vendors to develop new Flip Chip CSP Packaging technologies and materials for various end applications
• Maintain product quality while developing and introducing new bump and FCCSP technologies and package structures including cost reduction programs
• Coordinate the introduction of new FCCSP assembly processes, package structures and materials into production
• Prepare and/or update specifications and application notes for FCCSP technologies

Minimum requirements:

• Bachelor’s degree in Chemical Engineering, Mechanical Engineering, Electrical Engineering or other related Engineering degree
• Minimum 10 years of relevant experience in Flip Chip interconnect, Substrate Technology and FCCSP Packaging manufacturing technology
• Experience in package design, new material development and electrical/thermal/mechanical modeling to support development

Preferred qualifications:

• Experience developing new Flip Chip packaging technology solutions with assembly sites and interfacing with suppliers
• Experience with FCCSP substrate technologies, design rules and developing substrate materials for advanced packaging
• Experience in data analysis, automation and AI/ML to enhance package design, reliability and manufacturing process
• Experience in bump and wafer level packaging technology processes
• Experience in package design, new material development and electrical/thermal/mechanical modeling to support development
• Experience designing new design of experiments (DOEs) to develop a new process, materials or to support failure analysis
• Ability to establish strong relationships with key stakeholders critical to success and driving alignment, both internally and externally
• Strong verbal and written communication skills
• Ability to quickly ramp on new systems and processes
• Demonstrated strong interpersonal, analytical and problem-solving skills
• Ability to work in teams and collaborate effectively with people in different functions
• Ability to take the initiative and drive for results
• Strong time management skills that enable on-time project delivery