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Qualcomm SoC Thermal Engineer 
United States, California, San Diego 
152225820

18.09.2024

Job Area:

Engineering Group, Engineering Group > ASICS Engineering

Qualcomm is actively seeking design and design management candidates for the Digital Technology (DTECH) team. This person would conduct thermal optimization analysis for SoC, package, and system design to maximize performance under thermal power envelope for various applications such as smart phones, IoT and Automotive.

  • Support SoC design by providing thermal analysis throughout product development cycle to address thermal risks, including thermal analysis, post silicon validation and working with external customers.

  • Conduct SoC level thermal analysis to support architecture studies and Power Performance Area Thermal Optimization.

  • Implement solutions at SoC, package and system level to maximize chip performance under thermal power envelops.

  • Identifying needs and develop advanced thermal technologies as needed to support future Qualcomm products

  • All Qualcomm employees are expected to actively support diversity on their teams, and in the Company.

Preferred Qualifications

  • Master's or PhD in Science, Engineering, or related field.

  • Strong background in heat transfer and fluid mechanics simulation methods and fundamentals (CFD or FEM) through graduate level course work or industry experience.

  • Strong background in computer programming for numerical simulation and scripting skills for automation.

  • Experience with thermal simulation methodologies and simulation tools such as ANSYS ICEPAK

  • Experience with measurement: IR camera, thermocouples

  • Experience with thermal material: Graphite sheet, thermal paste, TIM, heat pipe.

  • Experience in thermal simulations at SoC, package and system levels in Mobile industry is highly desired

  • The candidate should be a good team builder with excellent people skills and used to operating in networked and virtual team environments. Natural self-starter, self-motivated, independent and resourceful problem solver. Outstanding oral and written communication skills capable of presenting persuasively to all levels of the organization in an articulate and succinct manner. Active listening ability. The candidate should be able to establish relationships to build credibility and influence at all levels of the organization in appropriate manners.

Minimum Qualifications:

• Bachelor's degree in Science, Engineering, or related field and 2+ years of ASIC design, verification, validation, integration, or related work experience.

Master's degree in Science, Engineering, or related field and 1+ year of ASIC design, verification, validation, integration, or related work experience.

PhD in Science, Engineering, or related field.

Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.

Pay range:

$108,000.00 - $162,000.00