Amazon Sr ASIC Packaging Engineer Annapurna Labs 

United States, Texas, Austin 

141202405

You will collaborate with architects, design teams, software engineers to deliver the next generation ML chip. In this position, you will have the opportunity to be responsible for IP integration, 2.5D design, bring up, Characterization and validation.Key job responsibilities
- Evaluation of packaging and assembly technology roadmap aligned to Annapurna product roadmap- Explore and provide recommendations on both available and future packaging and assembly technologies for Annapurna’s products
- Engage with substrate and assembly vendors on future technologies roadmap
- Assume full ownership of mechanical and thermal performance of Annapurna ICs
- Work with Assembly, Test and Logistics to define work flows at OSATs (focus on Fab/assembly/test interfaces)
- Track assembly and substrate yields and look for ways to improve themDiverse Experiences
AWS values diverse experiences. Even if you do not meet all of the qualifications and skills listed in the job description, we encourage candidates to apply. If your career is just starting, hasn’t followed a traditional path, or includes alternative experiences, don’t let it stop you from applying.About AWSWork/Life Balance
Mentorship & Career Growth
We’re continuously raising our performance bar as we strive to become Earth’s Best Employer. That’s why you’ll find endless knowledge-sharing, mentorship and other career-advancing resources here to help you develop into a better-rounded professional.

- High communication skills
- Dive deep quickly into unfamiliar domains
- Strong analytic and problem-solving skills
- Ability to work independently on multiple issues
- Good understanding of transmission line theory, power delivery and signal integrity is desired.
- Strong programming and scripting skills in Perl, Python, Tcl desired, Cadence Skill and EXCEL familiarity are helpful.
- Enthusiastic and able to work with a minimum of supervision.
- Can solve complex technical problems.