Bachelor's degree in Mechanical Engineering, Product Design, or related field, or equivalent practical experience.
12 years of experience in electronics packaging/server systems/data center or related industry.
12 years of experience with thermal analysis modeling and characterization.
5 years of experience with leading technical teams with product development.
Preferred qualifications:
Master's degree in Mechanical Engineering, Product Design, or related field, or equivalent practical experience.
Experience providing technical leadership by establishing project goals, co-ordinating resources, and solving system issues through technical innovation.
Experience in one or more advanced cooling techniques such as liquid cooling, thermal interface materials, thermo-electric devices, two-phase heat transfer or heat exchangers.