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Apple IC Package Integration Engineer United States, California 101502646
07.04.2025
- BS and +3 years of relevant industry experience.
- We are looking for someone with experience in Semiconductor Packaging Design, Process & Technology Development
- Good understanding of cross-functional packaging areas: Si floor plan, package layout and architecture, enabling process technologies, thermal, mechanical, SI/PI, material, component & system level reliability, testing, and FA
- Knowledgeable in advanced packaging technologies: Knowledge and insight to deliver high density / high performance interconnects in various form factor, thermo-mechanical, reliability, and cost constraints
- Excellent problem solving with strong physics and fundamentals
- Excellent communication skills that enable the candidate to work well with internal cross functional teams and overseas suppliers
- Multi-functional coverage on package layout (Cadence APD/Allegro), critical signal integrity / power integrity, thermal, design rules, BOM, design for manufacturing, reliability, and cost
- Ability to work independently and take on projects with minimum supervision
- Ability to lead and manage teams
- Knowledge of Cellular packaging and systems a plus
Note: Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program.
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