דרושים Test Engineer Bms ב-Texas Instruments ב-United States, Dallas

In this role, responsibilities may include:

• Drive system level and transistor level design of high performance switching regulators, translating system requirements to chip and block level architecture and specifications
• Perform detailed analysis of switching regulator efficiency, electro-migration, thermal management.
• Debug complex use case conditions to isolate root cause
• Lead an Analog IC design team with product ownership and responsibility from definition to release to manufacturing
• Make assignments for team members, providing design guidance as needed, developing schedules and monitoring progress throughout the project
• Work with and provide guidance to physical designers and monitors the progress of IC layout
• Evaluate system-level use-cases and re-create these in simulation
• Interface and lead discussions with the customer to understand customer designs, problems and support as required
• Collaborate with validation, product engineering and test engineering teams to enable successful transfer to production

Minimum requirements:

• Master's degree in Electrical Engineering
• Minimum 5+ years of relevant experience
• Extensive background in Power IC design

Preferred qualifications:

• Extensive experience in switching DCDC regulators design e.g. multi-phase buck, boost and buck-boost converters. Deep understanding of different control architectures.
• Deep understanding of power stage design and layout including gate drivers, fault systems and power FETs.
• Experience working with layout team on block and top level floor-planning
• Knowledge of device physics and process technologies tradeoffs that are applicable to Power IC design
• Expertise in tools e.g. Spectre, Simplis, Matlab and AMS
• Strong verbal and written communication skill
• Ability to take the initiative and drive for results
• Strong time management skills that enable on-time project delivery
• Ability to work in teams and collaborate effectively with people in different functions
• Demonstrated ability to build strong, influential relationships
• Working well in a team environment is imperative in this role

Why TI?

· Engineer your future. We empower our employees to truly own their career and development. Come collaborate with some of the smartest people in the world to shape the future of electronics.

· We're different by design. Diverse backgrounds and perspectives are what push innovation forward and what make TI stronger. We value each and every voice, and look forward to hearing yours.

· Benefits that benefit you. We offer competitive pay and benefits designed to help you and your family live your best life. Your well-being is important to us.

Job Description:

Kilby Labs is looking for abiomedical systems/applications engineer to do research and development on

Integrated semiconductor-based sensing technology’s applications range from industrial sensor applications to future of point of care diagnostic tools and wearables. Decentralized healthcare requires more accurate, portable, and multiplexed diagnostic tools. We are looking for biomedical sensor experts to do research and development on electrochemical/magnetics/optical/ultrasound-based sensors to enable breakthroughs in this field. Key responsibilities include • Develop semiconductor-based biomedical sensing technology roadmap • Validate and benchmark sensor chips • Identify and engage service providers for functionalization of sensor surface• Work with customers to define concepts and prototypes towards product • Work with internal product teams to productize research prototypes

Responsibilities may include:

• Research and create new product definitions, including developing business case proposals, product strategies and taking products to market
• Analyze and identify trends in clinical and consumer grade medical point of care devices, identifying opportunities for improving performance and adding value to these systems
• Assess and negotiate IC development tradeoffs with design team and customers
• Be the technical expert, responsible for product ramp up at the customer
• Silicon system evaluation (HW, SW if needed) and related documentation
• Application support for prototypes, newly introduced and existing products
• Support and train central applications engineering and sales organizations on new/existing products
• Relentlessly drive new design wins for new and existing products
• Trouble-shoot customer application issues by lab testing, schematic analysis and other methods, as necessary
• Bring quick resolution to customer problems by interfacing across different functional groups such as design, product, test, packaging, marketing and sales
• Assist with generating the revenue plan for the organization
• Definition of successful new products at TI, system evaluation and taking the products to market
• Create technical literature such as datasheets, application notes, EVM user's guides, spice models etc.
• Drive Revenue growth through promotion of new and existing products
• Build relationships with customers/field teams by closely interacting with them to identify and solve system problems with TI silicon
• Contribute to the short- and long-term product strategy and roadmap

Minimum requirements:

• Masters/Ph.D. in Electrical Engineering, Biomedical Engineering or related field.
• 5+ years of relevant experience

Preferred requirements:

• Strong biomedical sensing background
• Good understanding of analog/mixed-signal IC’s and their applications
• Experience promoting/marketing ICs and driving design wins by providing system solutions
• Strong customer-facing skills
• Familiarity with lab equipment and silicon validation
• System level circuit modeling with EDA tools, SPICE, Matlab
• Background on electrochemical and/or point of care wearable or diagnostic devices
• Knowledge of industry trends, industry standards, supply chain, and reliability requirements.
• Participation in international Standards committee, publication record in field related journals, magazines or conferences. Ability to establish strong relationships with key stakeholders, both internally and externally
• Strong verbal and written communication skills
• Ability to quickly ramp on new systems and processes
• Demonstrated strong interpersonal, analytical and problem-solving skills
• Ability to work in teams and collaborate effectively with people in different functions
• Ability to take initiative and drive for results

This position will be located in Dallas, Texas

Why TI?

• Engineer your future. We empower our employees to truly own their career and development. Come collaborate with some of the smartest people in the world to shape the future of electronics.
• We’re different by design. Diverse backgrounds and perspectives are what push innovation forward and what make TI stronger. We value each and every voice, and look forward to hearing yours.
• Benefits that benefit you. We offer competitive pay and benefits designed to help you and your family live your best life. Your well-being is important to us.

Core Responsibilities include, but are not limited to:

• MEMS Device/component layout, simulation (FEM) and optimization
• MEMS process integration and fabrication evaluation and device characterization
• Collaboration with fab/manufacturing engineers to ensure device manufacturability
• Collaboration with reliability engineers to enable device reliability
• Collaboration with modeling and PDK engineers for modeling and technology enablement
• Collaboration with packaging and product teams to ensure product capability of device
• Failure root-cause investigation for device/process/reliability/yield/product improvements
• Work closely with product groups and other partners to enable new business opportunities utilizing MEMS resonator technologies and establish roadmap direction
• Report project updates at regular intervals to management/stakeholders including and business partners

Minimum Requirements:

• Master's Degree in Electrical Engineering, Mechanical Engineering, Materials Science, Physics or related engineering degree, preferably with focus on MEMS resonator devices
• 5+ years of experience in MEMS resonator device development (BAW, SAW, and/or mechanical resonators or related devices) including design, layout, finite-element simulation, process flow development and fabrication, and characterization/analysis

Preferred Qualifications:

• PhDin Electrical Engineering, Mechanical Engineering, Materials Science, Physics or related engineering degree, preferably with focus on MEMS resonator devices
• Strong background in RF BAW and related resonator physics and technology development
• Strong background in RF and clock/timing circuits and electromagnetism
• Proven track record of getting MEMS devices qualified for marketable products
• Understanding of equivalent device circuit models for acoustic resonator devices
• Understanding of MEMS packaging flow and interactions with MEMS resonator devices
• Strong Project management/organization/communication skills
• Materials/process interaction knowledge/experience
• Demonstrated strong interpersonal, analytical and problem-solving skills
• Ability to work in teams and collaborate effectively with people in different functions
• Ability to take the initiative and drive for results
• Strong time management skills that enable on-time project delivery

At TI, Product and System Engineers work to identify ideal roadmap opportunities for a business and are responsible for defining new products and platforms based on market opportunity. To do this, they leverage strong technical knowledge of our existing portfolio, deep understanding of the technologies, standards and protocols within an industry or end equipment, and an ability to engage with customers and translate their requirements into technical specifications that will solve their problems. Systems engineers also partner closely with marketing and applications engineers, as well as design teams, to ensure our roadmap is both meeting customer and market requirements and is technically optimized and manufacturable at a price and cost point that makes sense for the business.

Responsibilities may include:

• Research and create new audio MEMS product definitions, including developing business case proposals, product strategies and taking products to RTM
• Translate audio MEMS product requirements to clear specification for the MEMS device, package, circuits, and test requirements.
• Assess and negotiate the different trade-offs between device design, circuit, and package to meet customer requirements.
• Maintain efficient and clear communication across all stakeholders for process, device, circuit, package, and test for successful and timely product RTM.
• Create technical literature such as datasheets, application notes, user's guides, EVMs, spice models, SCMs etc.
• Be the technical expert, responsible for product ramp up for the customer
• Build relationships with customers/field teams by closely interacting with them to identify and solve system problems with TI silicon
• Contribute to the short and long term product strategy and roadmap

Minimum requirements:

• Bachelor's degree in Electrical Engineering
• 10 years of relevant experience working with MEMS Microphones, audio devices, and associated circuits.
• Experience integrating MEMS microphones into automotive and consumer products.
• Experience developing and designing audio signal chain from analog front-end to digital processing and communication buses.
• Strong customer facing skills, and ability to translate customer requirements into system and device level specifications.

Preferred qualifications:

• MSc or PhD degree in Electrical Engineering
• Deep understanding of MEMS microphones physics, construction, operation, limitations, design tradeoffs, and integration into products.
• Proven track record of leading audio products development cycles, from early prototyping to production ramp.
• Experience designing MEMS microphone packages for different applications, with deep understanding of automotive quality standards and IPX ratings.
• Demonstrated experience designing analog front-end for MEMS microphone and subsequent signal chain blocks.
• Experience designing MEMS devices and associated packages for manufacturability with high process yield.

As a member of our Flip Chip packaging team, you'll have the chance to interact with many product groups and functions. You'll have high visibility on your projects, with strong opportunities for growth both within our team and across the Packaging Technology Solutions organization.
Responsibilities may include:

• Develop new requirements for Flip Chip CSP (FCCSP) packaging and bump process development and maintain quality of existing packages for Automotive, Industrial, Aerospace & Defense, Mobile and Enterprise applications
• Define FCCSP assembly and bump process requirements based on customer requirements and end applications
• Develop new bump and flip chip packaging technologies and process qualification programs
• Perform integrity analysis of bump and flip chip packaging technologies utilizing appropriate tools
• Perform bump and flip chip package technologies characterizations including cost effectiveness studies
• Act as a liaison with OSATs (outsourced assembly test sites), internal assembly sites and material vendors to develop new Flip Chip CSP Packaging technologies and materials for various end applications
• Maintain product quality while developing and introducing new bump and FCCSP technologies and package structures including cost reduction programs
• Coordinate the introduction of new FCCSP assembly processes, package structures and materials into production
• Prepare and/or update specifications and application notes for FCCSP technologies

Minimum requirements:

• Bachelor’s degree in Chemical Engineering, Mechanical Engineering, Electrical Engineering or other related Engineering degree
• Minimum 10 years of relevant experience in Flip Chip interconnect, Substrate Technology and FCCSP Packaging manufacturing technology
• Experience in package design, new material development and electrical/thermal/mechanical modeling to support development

Preferred qualifications:

• Experience developing new Flip Chip packaging technology solutions with assembly sites and interfacing with suppliers
• Experience with FCCSP substrate technologies, design rules and developing substrate materials for advanced packaging
• Experience in data analysis, automation and AI/ML to enhance package design, reliability and manufacturing process
• Experience in bump and wafer level packaging technology processes
• Experience in package design, new material development and electrical/thermal/mechanical modeling to support development
• Experience designing new design of experiments (DOEs) to develop a new process, materials or to support failure analysis
• Ability to establish strong relationships with key stakeholders critical to success and driving alignment, both internally and externally
• Strong verbal and written communication skills
• Ability to quickly ramp on new systems and processes
• Demonstrated strong interpersonal, analytical and problem-solving skills
• Ability to work in teams and collaborate effectively with people in different functions
• Ability to take the initiative and drive for results
• Strong time management skills that enable on-time project delivery

Core Responsibilities include, but are not limited to:

• TMR Sensor device/component layout and material stack design optimization thru simulation (TCAD) and experimental investigation
• Process integration and fabrication evaluation and device characterization
• Collaboration with fab/manufacturing engineers to ensure device manufacturability
• Collaboration with reliability engineers to enable device reliability
• Collaboration with modeling and PDK engineers for modeling and technology enablement
• Collaboration with packaging and product teams to ensure product capability of device
• Failure root-cause investigation for device/process/reliability/yield/product improvements
• Work closely with product groups and other partners to enable new business opportunities and establish roadmap direction in magnetic sensing
• Report project updates at regular intervals to management/stakeholders including and business partners

Minimum Requirements:

• Master's Degree in Electrical Engineering, Physics, Materials Science or related engineering degree, preferably with a focus on MTJ devices
• Excellent understanding of MTJ ferromagnetic stack materials and device physics
• 5+ years of experience in TMR and related devices for magnetic sensing including design, layout, finite-element simulation, process flow development and fabrication, and characterization/analysis

Preferred Qualifications:

• PhD inElectrical Engineering, Physics, or Materials Science, or related engineering degree, preferably with a focus on MTJ devices
• Strong background/experience in ferromagnetic materials, devices, and processing
• Strong background in analog circuits, particularly in conjunction with TMR and related magnetic sensing devices
• Strong understanding of semiconductor devices and technology development
• Proven track record of getting TMR devices qualified for marketable products
• Understanding of equivalent device circuit models for TMR sensing devices
• Strong Project management/organization/communication skills
• Materials/process interaction knowledge/experience
• Demonstrated strong interpersonal, analytical and problem-solving skills
• Ability to work in teams and collaborate effectively with people in different functions
• Ability to take the initiative and drive for results
• Strong time management skills that enable on-time project delivery

Responsibilities include:

• Creating test algorithms and test programs for advanced technology and component assessment leveraging parametric on-wafer automated test systems (Keysight, Keithley tester platforms) and auto-probers (Accretech, Tel, Electroglas)
• Collaborate with process integration engineers, reliability engineers, test engineers, and SPICE modeling engineers for creating test standards, test program development requirements, and data collection to meet technology development milestones
• Partnering with technologists to ensure robust characterization solutions are available for emerging and pathfinding technologies with novel components
• Generating and delivering test programs to the fab manufacturing test teams for production process monitoring
• Driving efficiency and continuous testing improvements through automation
• Characterizing all component types across a wide range of process, bias, temperature
• Building infrastructure to enable efficient characterization to support rapid learning cycle technology development

Minimum requirements:

• Bachelor's degree in Electrical Engineering, Physics, Engineering Physics or related
• 5+ years of industry experience in Test and Measurement with emphasis on the Keysight/Agilent test platforms 4070 and/or 4080 based test systems

Preferred qualifications:

• The ideal candidate will have expertise in testing fundamentals, experience with semi-automated and automated characterization methods, tools, and equipment, understanding of semiconductor device physics, and programming experience
• Experience and proficiency in the following areas is also preferred: test and measurements with parametric testers (Keysight, Keithley platforms), programming with SPECS (Keysight), KTE (Keithley), basic programming experience with
  MATLAB,
  Labview, C, and Unix Shell; and an aptitude for running various software scripts and utilities
• Strong verbal and written communication skills
• Ability to work in teams and collaborate effectively with people in different functions
• Ability to take the initiative and drive for results
• Strong time management skills that enable on-time project delivery
• Working well in a team environment is imperative in this role
• Demonstrated ability to build strong, influential relationships
• Good listener and excellent verbal and written communication skills