דרושים Technical Sales Program New Grad ב-Texas Instruments ב-יפן

When you join TI, you will participate in the Career Accelerator Program (CAP), which provides professional and technical training and resources to accelerate your ramp into TI and set you up for long-term career success. Within this program, we also offer function-specific technical training and on-the-job learning opportunities that will encourage you to solve problems through a variety of hands-on, meaningful experiences from your very first day on the job.

This 12-month experience aims to establish rising Field Applications Engineers (FAEs) as technical TI experts with customer engineers and internal teams. The track includes two 6-month rotations*:

Upon successful completion of the Field Applications Engineer track, participants are welcomed as FAEs on TI's Worldwide Sales & Applications team. FAE responsibilities include:

• Using various sales tools and relationships with design engineering to identify all potential projects
• Providing customers with proactive proposals for complete, system-level solutions that maximize TI content
• Using broad technical expertise to influence customers' part selection process while favorably positioning TI versus competition

Minimum requirements:

• Bachelors degree in Electrical Engineering, Electronics Technology, Electrical Engineering Technology, Electrical and Computer Engineering or related field
• Fluent in local language and English, both written and oral communication skills
• Basic understanding of schematics, layouts and digital components
• Knowledge and understanding of analog circuitry (examples include: op-amps, DC/DC power, data converters, sensing, etc.)
• Experience with lab equipment, like oscilloscopes, along with soldering and debugging skills

Preferred qualifications:

• Experience with lab equipment such as oscilloscopes, along with soldering and debugging skills
• Programming skills in C/C++ (LabView recommended)
• Demonstrated strong analytical and problem solving skills
• Excellent communication and presentation skills
• Ability to work in teams and collaborate effectively with people in different functions
• Strong time management skills that enable on-time project delivery
• Ability to build lasting, influential relationships, both inside and outside the organization
• Ability to work effectively in a fast-paced and ever-changing environment
• Ability to take initiative and drive for results
• Ability to influence decisions through a sense of urgency and competitive drive

About the Job

A brand marketing professional who is responsible for the handling and management of brand marketing operations and channel for TI Japan with below area of responsibilities:

• Brand Marketing Operations & Channel: S/he will work closely with Rest of Asia* Brand Marketing Operations and Channel Manager and Japan Brand Marketing Manager to define, create and execute brand marketing programs in Japan that promotes TI’s focus areas and further drives local business growth.

*Japan, Korea, Taiwan and South Asia

Responsibilities include:

• Channel Management: Collaborate with cross-functional teams, including search, paid media, social, email, programmatic, video teams and local agencies to develop tailored solutions that build stronger brand preference. Responsibilities include, but are not limited to strategy development, tactic execution, audience segmentation, and ads creative management.
• Channel Optimizations and Data Analysis: Collaborate with the Rest of Asia Brand Marketing Operations and Channel Manager to analyze channel performance metrics as well as market trends to identify growth opportunities and make data-driven decisions to optimize brand marketing campaigns. These campaigns aim to achieve specific marketing objectives, such as increasing brand awareness, generating leads, or driving TI.com activities.
• Webinars and Events: Coordinate TI-owned events (i.e. in-person seminars, webinars, Tech Day, Tradeshow), including, but not limited to promotion strategy, customer experience mapping, branding at the events, agency management, speaker management, registration related settings, event reporting, analysis and optimization.
• Platform and Process Management: Agile adoption and swift proficiency in TI tools and platforms. Streamline processes, workflows, and key documents in the team to maximize efficiencies and effectiveness in campaign execution.

Role requirements:

• 1 – 5 years of relevant experience in digital marketing, event marketing, paid and organic channels, data analytics.
• Fluent in written and spoken English and Japanese. Fluency in Korean or Chinese is a plus
• Excellent time-management and project management skills to simultaneously drive on-time execution of multiple projects.
• Ability to prioritize action plans and work through ambiguity.
• Clear, concise communication skills, both verbal and written in both English and Japanese.
• Proactive and positive attitude with strong collaboration skills and team-focused and results-oriented mindset.
• Ability to solve difficult problems with creative solutions.

Preferred qualifications & experience:

• Knowledge of the high-tech or semiconductor industries are preferred, but not required
• Experience with digital marketing paid and organic channels and event management.
• Proficiency in utilizing AI tools and technologies to enhance productivity and streamline workflows.

・「TSE」の役割を学ぶ
お客様や市場のリサーチ方法を学び、営業戦略を考える
顧客情報やケーススタディを使い、顧客へのアプローチ方法を考える
お客様との会議や社内会議に参加する（英語で参加の可能性あり）
TSE若手社員との座談会
社長との座談会（英語）
社員から発表やロールプレイに関するfeedbackあり
インターン生１人につき、先輩社員のメンターが1名つき、インターン中サポートいたします

【入社一年目にUS本社研修あり】
技術営業部に入社する新卒入社向けFAST (Field Applications & Sales Training) トレーニングプログラムを実施します。
技術的なスキルとビジネスの視点を組み合わせた、セールスのキャリア向けに作られたプログラムとなっています。そのプログラムを通じて、TI のビジネス成長に貢献し、TI でのキャリアを通じて活躍できるような経験を得ることができます。

東京本社 ：東京都港区港南1-2-70　品川シーズンテラス31F
名古屋営業所：愛知県名古屋市中区錦 2-4-3　錦パークビル 17階
大阪営業所　：大阪府大阪市淀川区宮原4-5-41　新大阪第2NKビル9F

交通費、宿泊費：支給あり（当社規定に基づき支給します。）
報酬：日当支給（9600円/日）

理系学生
★こんな人におすすめ
BtoBビジネス、半導体業界や先進技術に関わる業界に関心がある方
電気・電子の基礎知識がある方
メーカーの営業的側面を学びたい方
英語を活かして仕事を経験したい方（TOEIC600点以上）

Packaging engineers play an important role at TI which encompasses the following responsibilities:

• Partner with the businesses to design and develop internal and external solutions for semiconductor packaging technologies, including Wirebond, Flip Chip, Modules, SIPs and other advanced packages at different stages of readiness
• Participate in cross-functional teams, supporting product qualification and production, helping to meet reliability and yield requirements, design testability, and test coverage
• Direct design-of-experiments and work with material suppliers to downselect innovative packaging materials to enhance the reliability and performance of advanced packages.
• Conduct electrical, mechanical, thermal models to comprehend silicon-to-package interaction, establish design rules, and to predict and prevent the use of high risk designs.

Minimum Requirements:

• Student whowill graduate in 2025 or 2026 or graduated in 2024 or 2025
• Bachelors degree in Material Science, Mechanical Engineering, Chemical Engineering, Polymer Science or Physics, Electrical Engineering
• Fluent in Japanese
• Communication skill

Preferred Qualifications:

• Master degree
• Study about inductor, coil, magnetics and motor. Simulation experience with Ansys or original model.

When you join TI, you will participate in the Career Accelerator Program (CAP), which provides professional and technical training and resources to accelerate your ramp into TI and set you up for long-term career success. Within this program, we also offer function-specific technical training and on-the-job learning opportunities that will encourage you to solve problems through a variety of hands-on, meaningful experiences from your very first day on the job.

This 7-month experience aims to teach Technical Sales Associates (TSAs) how to build and manage customer relationships, and how to influence decisions to grow TI's revenue. The track includes three rotations*:

Upon successful completion of this track in the FAST program, participants are welcomed as Technical Sales Representatives (TSRs) on TI's Worldwide Sales& Applications team. Technical Sales Representative responsibilities include:

• Using technical expertise, various sales tools and relationships with engineering teams to identify projects
• Managing and quantifying leads, and managing the commercial aspects of customer relationships
• Developing, forecasting and monitoring an annual plan for revenue growth

Minimum requirements:

• Student who will graduate in 2026
• Bachelors degree in Electrical Engineering, Computer Engineering, Electrical and Computer Engineering or related field
• Fluent in local language and English, both written and oral communication skills

Preferred qualifications:

• Ability to establish strong relationships with key stakeholders critical to success, both internally and externally
• Strong verbal and written communication skills
• Ability to quickly ramp on new systems and processes
• Demonstrated strong interpersonal, analytical and problem-solving skills
• Ability to work in teams and collaborate effectively with people in different functions
• Ability to take the initiative and drive for results
• Strong time management skills that enable on-time project delivery

Packaging engineers play an important role at TI which encompasses the following responsibilities:

• Partner with the businesses to design and develop internal and external solutions for semiconductor packaging technologies, including Wirebond, Flip Chip, Modules, SIPs and other advanced packages at different stages of readiness
• Participate in cross-functional teams, supporting product qualification and production, helping to meet reliability and yield requirements, design testability, and test coverage
• Direct design-of-experiments and work with material suppliers to downselect innovative packaging materials to enhance the reliability and performance of advanced packages.
• Conduct electrical, mechanical, thermal models to comprehend silicon-to-package interaction, establish design rules, and to predict and prevent the use of high risk designs.

Minimum Requirements:

• Bachelors degree in Material Science, Mechanical Engineering, Chemical Engineering, Polymer Science or Physics, Electrical Engineering
• Cumulative 3.0/4.0 GPA, or higher

Preferred Qualifications:

• Basic understanding of statistical process control (SPC)
• Semiconductor packaging knowledge is preferred (manufacturing processes, assembly, reliability, materials, characterization, FA)
• Demonstrated analytical and problem solving skills
• Strong written and verbal communication skills
• Ability to work in teams and collaborate effectively with people in different functions
• Strong time management skills that enable on-time project delivery
• Ability to build strong, influential relationships
• Ability to work effectively in a fast-paced and rapidly changing environment
• Ability to take the initiative and drive for results

As a Facilities Engineer at TI, you'll be directly responsible for building utility systems in support of a semiconductor wafer fab. TI Facilities operates over 150 different utility systems that include chemicals, gasses, variety of electrical systems, water systems, HVAC, waste, vacuum, and controls. These systems are designed to run 24 hours a day, 365 days a year without interruption, creating a state of the art manufacturing environment. Facilities works closely with TI's manufacturing team to understand how the utility systems impact the process as well as how to reduce consumption.
Responsibilities include:

• Manage requested projects and equipment installations, including project resources, schedules and budgets
• Provide technical support to the Facilities organization as a system expert over time
• Team with other engineering disciplines, management, internal customers, and suppliers to ensure projects and systems are cost effective, within budget, meet the desired design criteria and schedule guidelines
• Communicate and document the sequence of operations and design intent to others requiring information
• Provide capacity/demand analysis of utility systems and planning to support growth when required
• Provide analysis of critical utility systems to understand risks and developing solutions based on assessment
• Develop and review maintenance and operational procedures to ensure best practices are in place and documented properly
• Design and manage turnkey projects and coordinating contract work in the field

Minimum requirements:

• Bachelors degree in Electrical Engineering, Electrical Engineering Technology, Chemical Engineering, Mechanical Engineering, Controls Engineering, Mechanical Engineering Technology, or Civil Engineering
• Cumulative 3.0/4.0 GPA or higher

Preferred qualifications:

• Ability to establish strong relationships with key stakeholders critical to success, both internally and externally
• Strong verbal and written communication skills
• Demonstrated leadership and project management skills, including time management and priority setting
• Ability to quickly ramp on new systems and processes
• Demonstrated strong interpersonal, analytical and problem-solving skills
• Ability to work in teams and collaborate effectively with people in different functions
• Ability to take the initiative and drive for results
• Strong time management skills that enable on-time project delivery