Job Description
Packaging engineers play an important role at TI which encompasses the following responsibilities:
- Partner with the businesses to design and develop internal and external solutions for semiconductor packaging technologies, including Wirebond, Flip Chip, Modules, SIPs and other advanced packages at different stages of readiness
- Participate in cross-functional teams, supporting product qualification and production, helping to meet reliability and yield requirements, design testability, and test coverage
- Direct design-of-experiments and work with material suppliers to downselect innovative packaging materials to enhance the reliability and performance of advanced packages.
- Conduct electrical, mechanical, thermal models to comprehend silicon-to-package interaction, establish design rules, and to predict and prevent the use of high risk designs.
Minimum Requirements:
- Student whowill graduate in 2025 or 2026 or graduated in 2024 or 2025
- Bachelors degree in Material Science, Mechanical Engineering, Chemical Engineering, Polymer Science or Physics, Electrical Engineering
- Fluent in Japanese
- Communication skill
Preferred Qualifications:
- Master degree
- Study about inductor, coil, magnetics and motor. Simulation experience with Ansys or original model.
Why TI?
- Engineer your future. We empower our employees to truly own their career and development. Come collaborate with some of the smartest people in the world to shape the future of electronics.
- We're different by design. Diverse backgrounds and perspectives are what push innovation forward and what make TI stronger. We value each and every voice, and look forward to hearing yours.
- Benefits that benefit you. We offer competitive pay and benefits designed to help you and your family live your best life. Your well-being is important to us.
If you are interested in this position, please apply to this requisition.
TI does not make recruiting or hiring decisions based on citizenship, immigration status or national origin. However, if TI determines that information access or export control restrictions based upon applicable laws and regulations would prohibit you from working in this position without first obtaining an export license, TI expressly reserves the right not to seek such a license for you and either offer you a different position that does not require an export license or decline to move forward with your employment.
Job Info
- 25001971
- Job CategoryEngineering - Product Dev
- Posting Date19/06/2025, 03:41
- Degree LevelBachelor's Degree
- LocationsHIJI 1357 Oaza Oga Hiji-Machi, Oita-Pref, 879-1504, JP
- ECL/GTC Required
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