

Lead and manage a team of silicon physical design engineers responsible for end-to-end silicon design engineering activities supporting technology development, and product design execution on EMIB 2.5D/3.5D, Foveros S/R/B, and Foveros Direct 3D Intel foundry advanced packaging technologies.
Oversee planning, scheduling, and execution of design projects, ensuring milestones and deadlines are met.
Drive continuous improvement in design methodologies, flows, and processes to enhance quality and efficiency.
Collaborate with cross-functional teams (technology partners, packaging, analysis, and verification) to ensure seamless integration and manufacturability.
Provide technical leadership and mentorship, fostering a culture of innovation and accountability.
Responsible for enabling teams to execute through clear goal setting, facilitating work, maintaining accountability, applying differentiated performance management, and driving team results.
Drives results by inspiring people, role modeling Intel values, developing the capabilities of others, and ensuring a productive work environment.
Key Responsibilities:
Leadership and Management
Lead and manage a group of Silicon Packaging Engineers, providing guidance, mentorship, and support to ensure the successful execution of projects.
Oversee the planning, scheduling, and execution of package design projects, ensuring that milestones and deadlines are met.
Foster a collaborative and innovative team environment, encouraging continuous learning and professional development.
Lead design groups, coordinating efforts across multiple teams to achieve project goals.
Technical Expertise
Serve as the technical lead for the package design team cross multiple products.
Drive the development of advanced packaging designs, ensuring compliance with industry standards and best practices.
Collaborate with cross-functional teams, including package architects, silicon and board design teams, design rule owners, electrical analysis engineers, and integration teams to define and implement design specifications.
Leverage extensive experience in advanced packaging designs to meet design KPIs.
Influence.
Ensure products are designed and developed with high quality standards by overseeing design processes, risk management, and compliance throughout the product design lifecycle, working closely with cross-functional teams to identify and address potential quality issues before they arise.
Project Management
Develop and maintain detailed project plans, including resource allocation, risk management, and progress tracking.
Coordinate with stakeholders to ensure alignment on project goals, deliverables, and timelines.
Conduct regular project reviews and provide status updates to senior management.
Innovation and Improvement
Identify and implement process improvements to enhance the efficiency and quality of package designs and development.
Stay current with industry trends and emerging technologies, incorporating new methodologies and tools into the design process.
Drive innovation in product design, exploring new approaches and techniques to achieve competitive advantages.
The ideal candidate should exhibit the following behavioral traits:
Excellent leadership and team management skills, with the ability to inspire and motivate a diverse team of engineers.
Strong project management skills, with the ability to manage multiple projects simultaneously and meet deadlines.
Exceptional problem-solving and analytical skills, with a keen attention to detail.
Excellent communication and interpersonal skills, with the ability to collaborate effectively with cross-functional teams and stakeholders.
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Minimum Qualifications:
Bachelor's degree in Electrical Engineeringor STEM related field with 9+years of relevant experience
-OR- Master's degree in Electrical Engineeringor STEM related fieldwith 6+ years ofrelevant experience
-OR- PhD in Electrical Engineeringor STEM related fieldwith 4+ years of relevant experience
Relevant experience should include the following:
Experience in silicon design, with at least 3 years in a leadership role.
Proven experience in a leadership or management role, with a track record of successfully leading engineering teams and delivering complex projects withinestablished timelines.
Experience with design flows and methodologies (physical design, verification).
Experience working with EDA tools from Cadence, Synopsys, and/or Siemens.
Preferred Qualifications:
Experience with advanced nodes and packaging technologies
Experience in RTL2GDS flows and methodologies
Weoffer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here:
Annual Salary Range for jobs which could be performed in the US:This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.משרות נוספות שיכולות לעניין אותך

Responsibilities for this position include, but are not limited to:
Appliesengineering/technical
Applies advanced engineering knowledge of Intel and industry technology roadmaps, and technical knowledge of commodities to drive supply chain solutions ahead of Intel's needs.
Develops supply chain solutions that are tailored to unique Intel development needs for complex situations and products.
Leverages strong understanding of technology, contracting, negotiating, risk mitigation and supplier relationship management to manage supplier relationships, and provide sustainable cost, quality, availability, and technology solutions with adherence to procurement policies.
Coordinates purchasing activities with cross-functional teams to acquire materials and services in a cost effective and timely manner.
Ensures respective commodities meet technical specifications and cost requirements for Intel to develop products/services.
Works closely with engineering teams and suppliers to define standard and custom product requirements, influences technical design decisions, negotiates technical contract terms with suppliers to meet technical specifications and fulfil business objectives.
Conducts periodic reviews of commodity sourcing strategies in partnership with engineering teams/customers to shape strategic business objectives and account investments through aligned roadmaps.
Reviews and pivots sourcing strategies in response to changing market conditions and develops mitigation plans to ensure business continuity.
Works closely with finance and legal to resolve disputes with suppliers/internal partners.
Leads sustainability and regularly compliance and ensures suppliers comply with Intel business processes.
Understands Intel's technical roadmap and positions the supply chain to meet Intel's needs including alignment tosafety/availability/quality/sustainabilityframework.
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Minimum Qualifications:
Bachelor’s degree in Engineering, Material Science, Supply Chain Management, or related field with 8+ years relevant experience
— or —
Master’s degree in the same fields with 6+ years of relevant experience
— or —
PhD in the same fields with 4+ years relevant experience
Relevant work experience should be of the following:
Experience with Supply line and Capacity Management Planning
Experience with Semiconductor substrate manufacturing, supplier capability analysis and capacity expansion requirements
Experience with overall semiconductor packaging and advanced packaging requirements
Preferred Qualifications:
Engineering experience in manufacturing and/or supplier management
Experience in program management and setting technical recommendations and requirements
Weoffer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here:
Annual Salary Range for jobs which could be performed in the US:
Note: This role requires regular onsite presence to fulfill essential job responsibilities. Performs feasibility studies and provides integrated process solutions to meet desired safety, quality, reliability and output requirements for ultimate transfer to high volume manufacturing. Selects and develops material and equipment for the process to meet quality, reliability, cost, yield, productivity and manufacturability requirements. Plans and conducts experiments to fully characterize the process throughout the development cycle and to improve performance for each specific product. Identifies integrated process solutions to resolve issues or specific requests from customers by partnering with innovators in product engineering and module engineering teams. Conducts new product qualification and technology transfers from fabrication operations. Leverages big data analysis to identify process design weaknesses and/or manufacturing tool issues and proposes corrective, data-based solutions. Collaborates and engages with development and material suppliers, and partners to develop processes and equipment needs to meet technology roadmaps. As a principal engineer, recognized as a domain expert who influences and drives technical direction across Intel and industry. Develops and mentors other technical leaders, grows the community, acts as a change agent, and role models Intel values. Aligns organizational goals with technical vision, formulates technical strategy to deliver leadership solutions, and demonstrates a track record of relentless execution in bringing products and technologies to market.
Qualifications:Bachelor's degree inElectrical/ElectronicEngineering, &/or Computer Engineering, or Science, or other STEM-related degree and 7 years of progressively related experience.
Alternatively, Master's degree inElectrical/ElectronicEngineering, &/or Computer Engineering, or Science, or other STEM-related degree and 5 years of progressively related experience.
Shift 1 (United States of America)US, Arizona, PhoenixWeoffer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here:
Annual Salary Range for jobs which could be performed in the US:
development engineers to drive technology development and enablementacross the full range of patterning modules for advanced CMOS technologies
be responsible fordevelopment and drivingmanufacturability across key lithography tools includingbut not limited to DUV
Primary responsibilities willat the intersection of technology developmenthigh volumeespecially on new lithography processesthat require engineering to meet high volume requirements.
This includes driving safety,quality, performance, throughput, capability (patternand cost.
high volumeand will be
and develop the engineer
The leader will be asubject matter expert and have experience working with Integration and othermodules leaders such as etch and thin films to deliver modular solutionsthat meet the technology targets.
Qualifications:Minimum qualifications areto be initially considered for this position. Preferred qualifications are in addition to therequirements and are considered a plus factor inMinimum Qualifications:
14 years of relevant work experience in the semiconductor spacewith a strong focus on lithography
Degree in Electrical Engineering or Technical Equivalent
Prior senior management with large, multi-national manufacturing employers, preferably in hightechnology/scientific/semiconductorsectors with prior specialization in technology development.
Strong history of industry experience in process development, leadership, and semiconductor
Background working with a combination of investors and third- party suppliers on solutionoptimization/customizationto meet their manufacturing needsespecially with the industry leaders in lithography solutionssuch as ASML and KT.
Engineering group leader background at global scale including leading significant factory ramp-up and process technology development in high volume manufacturing environments.
Extensive experience instart-up with technicaltrack recordin multiple areas of semi-conductor sector in areas such as manufacturing engineering, quality and reliability, research and development, sourcing/supply chain innovations etc.Preferred Qualifications
Substantial technical background inlithography as used in advanced CMOS technologieswith a body of research and patents.Demonstrated history of delivering customized solutions in Research and Development and HVM organizations.related work experience in a semiconductor foundry preferredRequirements listed would be obtained through a combination of industry relevant job experience, internship
Weoffer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here:
Annual Salary Range for jobs which could be performed in the US:This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.
Key responsibilities:
Drive alignment for HP Commercial portfolios with Intel technologies to maximize business and revenue.
Negotiate pricing and NRE agreements to ensure optimal PFV value proposition for customers.
Foster innovation in HP's new product introductions in collaboration with Intel and HP Engineering teams.
Lead CTO-level engagements between HP and Intel architecture teams for future product development.
Collaborate with HPI account team go-to-market and regional sales teams to ensure the commercial business thrives.
Prepare for Executive and Quarterly Business Reviews, presenting strategic roadmap, product, and technology topics.
As a successful candidate, you must possess:
Advanced knowledge of CCG client technologies and a solid understanding of the PC ecosystem from design to sell-through.
Strong business acumen, interpersonal skills, and attention to detail.
Proficiency in PowerPoint and Excel, with the skills to present strategic topics to customers.
Strong skills to listen and understand customer needs and priorities, tackling complex problems and proposing solutions.
Experience working with HP is a plus, and the willingness to work fully remotely within the United States.
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. This position is not eligible for Intel immigration sponsorship.
Minimum Qualifications:
Preferred Qualifications:
offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here:
Annual Salary Range for jobs which could be performed in the US:This role is available as a fully home-based and generally would require you to attend Intel sites only occasionally based on business need. However, you must live and work from the country specified in the job posting, in which Intel has a legal presence. Due to legal regulations, remote work from any other country is unfortunately not permitted. * Job posting details (such as work model, location or time type) are subject to change.The application window for this job posting is expected to end by 01/02/2026
This role requires a blend of strategic vision, structured execution, and relationship management, and is best suited for a candidate who thrives in fast-paced, dynamic environments where priorities span multiple functions and geographies.
Your key responsibilities will include, but not limited to:
The ideal candidate will possess the following:
Minimum qualifications listed below would be obtained through a combination of industry relevant job experience, internship experience and / orschoolwork/classes/research.The preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Minimum Qualifications:
Preferred Qualifications:
Weoffer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here:
Annual Salary Range for jobs which could be performed in the US:
Works in country or region with partial ownership of multiple Intel lead external partners such as SIs, Solution Aggregators, and ISVs to drive Intel Partner Alliance (IPA) program and sales activities.
Sales may be local support for accounts managed globally.
Develops the partner business plan, implements partner programs, coordinates co-selling between partner and Intel's sales team, drives indirect billing and/or consumption through partners, while promoting Intel's products and services.
Builds trusted relationships with the partners to drive short term sales objectives while establishing scale via long-term strategic alignment with partners across the ecosystem.
Collaborates with product groups and other key internal stakeholders to develop and drive IPA program expansion.
Follows partner ecosystem trends and shares innovative perspectives to advance the joint business priorities and open new opportunities in the market/industry.
Supports go to market campaigns and collaborates on presales and proof of concept execution, and training programs, to ensure successful execution of the account plan targets and performance metrics.
Minimum Qualifications:
Master Degree in computer science,electronics/electrical/softwareengineering.
8+ years experience in Partner Account Sales and Engagement, Technology Advisory, Technical Sales.
Knowledge of IT technology, system architecture, system integration and ecosystem's solutions.
Excellent in team-work, collaboration, presentation communication skills.
Fluent in English and Vietnamese; adaptable to travel across Vietnam and overseas.
Preferred Qualifications:
Have wide professional network in IT industry.
Familiar with sales process management and project management.
Solid business and technical knowledge of the hardware, Data/ AI,infrastructure industry and ecosystem, and software.
Working experience in global technology company.
Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and orschoolwork/classes/research.
personal informationfor recruitment related activities and your data will not be used for any other purpose.We retain personal information for the periods and purposes set forth in. Retention periods can vary significantly based on the type of information and how it is used. We do not share your personal information with third parties.
by submitting your information andproceeding with this application, you agree and consent that we can collect your personal information. You will have the ability to opt-out by informingor at any timeselecting unsubscribe foundat the bottom of our future marketing communications.You have rights to correct, update, request access to or deletion of your personal information as described inIn addition, if you wish to update or otherwise make changes to your resume, useto resubmit a new resume.

Lead and manage a team of silicon physical design engineers responsible for end-to-end silicon design engineering activities supporting technology development, and product design execution on EMIB 2.5D/3.5D, Foveros S/R/B, and Foveros Direct 3D Intel foundry advanced packaging technologies.
Oversee planning, scheduling, and execution of design projects, ensuring milestones and deadlines are met.
Drive continuous improvement in design methodologies, flows, and processes to enhance quality and efficiency.
Collaborate with cross-functional teams (technology partners, packaging, analysis, and verification) to ensure seamless integration and manufacturability.
Provide technical leadership and mentorship, fostering a culture of innovation and accountability.
Responsible for enabling teams to execute through clear goal setting, facilitating work, maintaining accountability, applying differentiated performance management, and driving team results.
Drives results by inspiring people, role modeling Intel values, developing the capabilities of others, and ensuring a productive work environment.
Key Responsibilities:
Leadership and Management
Lead and manage a group of Silicon Packaging Engineers, providing guidance, mentorship, and support to ensure the successful execution of projects.
Oversee the planning, scheduling, and execution of package design projects, ensuring that milestones and deadlines are met.
Foster a collaborative and innovative team environment, encouraging continuous learning and professional development.
Lead design groups, coordinating efforts across multiple teams to achieve project goals.
Technical Expertise
Serve as the technical lead for the package design team cross multiple products.
Drive the development of advanced packaging designs, ensuring compliance with industry standards and best practices.
Collaborate with cross-functional teams, including package architects, silicon and board design teams, design rule owners, electrical analysis engineers, and integration teams to define and implement design specifications.
Leverage extensive experience in advanced packaging designs to meet design KPIs.
Influence.
Ensure products are designed and developed with high quality standards by overseeing design processes, risk management, and compliance throughout the product design lifecycle, working closely with cross-functional teams to identify and address potential quality issues before they arise.
Project Management
Develop and maintain detailed project plans, including resource allocation, risk management, and progress tracking.
Coordinate with stakeholders to ensure alignment on project goals, deliverables, and timelines.
Conduct regular project reviews and provide status updates to senior management.
Innovation and Improvement
Identify and implement process improvements to enhance the efficiency and quality of package designs and development.
Stay current with industry trends and emerging technologies, incorporating new methodologies and tools into the design process.
Drive innovation in product design, exploring new approaches and techniques to achieve competitive advantages.
The ideal candidate should exhibit the following behavioral traits:
Excellent leadership and team management skills, with the ability to inspire and motivate a diverse team of engineers.
Strong project management skills, with the ability to manage multiple projects simultaneously and meet deadlines.
Exceptional problem-solving and analytical skills, with a keen attention to detail.
Excellent communication and interpersonal skills, with the ability to collaborate effectively with cross-functional teams and stakeholders.
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Minimum Qualifications:
Bachelor's degree in Electrical Engineeringor STEM related field with 9+years of relevant experience
-OR- Master's degree in Electrical Engineeringor STEM related fieldwith 6+ years ofrelevant experience
-OR- PhD in Electrical Engineeringor STEM related fieldwith 4+ years of relevant experience
Relevant experience should include the following:
Experience in silicon design, with at least 3 years in a leadership role.
Proven experience in a leadership or management role, with a track record of successfully leading engineering teams and delivering complex projects withinestablished timelines.
Experience with design flows and methodologies (physical design, verification).
Experience working with EDA tools from Cadence, Synopsys, and/or Siemens.
Preferred Qualifications:
Experience with advanced nodes and packaging technologies
Experience in RTL2GDS flows and methodologies
Weoffer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here:
Annual Salary Range for jobs which could be performed in the US:This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.משרות נוספות שיכולות לעניין אותך