Bachelor's degree in Electrical, Process, or Manufacturing Engineering, or equivalent practical experience.
8 years of experience as a Manufacturing, Quality, Reliability, or Product Engineer.
7 years of experience in a Manufacturing Engineering role for Printed Circuit Board Assembly SMT processes, Design for Manufacturing, and process failure modes and effects analysis (FMEA).
Experienced in working with CMs/ODMs, contract manufacturers and suppliers to drive root cause analysis, corrective actions and continuous improvements.
Preferred qualifications:
Master's degree or PhD in Electrical, Mechanical, Industrial, Materials, or a related engineering field.
Experience setting up manufacturing assembly processes, driving product launches and assembly process optimization within manufacturing operations.
Experience with CAD tools (e.g., Valor, AutoCAD, Cadence Allegro, Gerber tools), Printed Circuit Board Assembly (PCBA) and system integration manufacturing, or process development experience in NPI.
Ability to provide communication and direction to the CMs/OMDs partners.
Ability to communicate in English and Mandarin fluently to support clients in this region.